Circuit Board Wire Formation via Controlled Foil Thickness
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Solution Overview
Problem
Existing methods for producing circuit boards using thermoplastic toner images and conductive foils often result in low resistance stability, leading to issues like wire chipping and short-circuits, especially when the conductive foil thickness is outside the optimal range of 0.1 μm to 2 μm.
Innovation Solution
A method involving the formation of a conductive foil layer with a thickness of 0.1 μm to 2 μm on a thermoplastic toner image, followed by heat application to create a wire, which enhances resistance stability and prevents excessive foil transfer failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conductive foil with thickness less than 0.1 μm or more than 2 μm is used, then the manufacturing process is simpler, but the resistance stability of the wires deteriorates
Solution Approach 1:
The patent applies parameter changes by specifying an optimal thickness range (0.1 μm to 2 μm) for the conductive foil. This quantitative parameter optimization resolves the contradiction by identifying that foils within this range achieve both ease of manufacture and high resistance stability, while foils outside this range cause wire chipping or short-circuits.
2Ease of manufacture
If a conductive foil with thickness less than 0.1 μm or more than 2 μm is used, then the manufacturing process is simpler, but wire chipping and short-circuits occur
Solution Approach 1:
The patent uses parameter changes by defining the optimal conductive foil thickness range of 0.1 μm to 2 μm. This specification prevents wire chipping and short-circuits while maintaining manufacturing simplicity, as foils outside this range cause integrity issues during the bonding process.
3Ease of manufacture
If heat is applied to the toner image and conductive foil layer, then the wire is formed successfully, but heat generation may cause chipping
Solution Approach 1:
The patent applies beforehand cushioning by pre-selecting conductive foils with optimal thickness (0.1 μm to 2 μm) that have sufficient heat resistance. This preparation cushions against the harmful effects of heat generation during the bonding process, preventing wire chipping while maintaining successful wire formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed method achieves high resistance stability in circuit board wires, suppressing heat generation and chipping, while maintaining the adhesiveness of the conductive foil at low temperatures, thus improving the overall quality and reliability of the circuit boards.
Implementation Method 1
forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil
Data Source
AI summary
A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.