Fold-Over Flexible Circuit for Compact Camera Module Integration
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Solution Overview
Problem
Conventional digital camera modules face challenges in minimizing size while maintaining high image quality and independent operation within host devices, as added features like variable focus/zoom and larger image capture devices increase overall module size.
Innovation Solution
A miniature camera module design utilizing a flexible circuit substrate with multiple portions, including a rigid-flex printed circuit board and anisotropic conductive film, allows for the integration of more electronic components without increasing the module's size by folding the substrate to position components efficiently and providing structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If variable focus/zoom device and larger image capture device are added to improve image quality, then image quality is improved, but overall camera module size increases
Solution Approach 1:
The patent embeds electronic components (ICD, memory chips, processors, resistors, capacitors, inductors) directly within the housing walls and cavity spaces of the camera module. The housing structure itself serves as a container for these components, nesting them within the existing form factor without requiring additional external space. This allows high-quality imaging components to be integrated while maintaining compact overall dimensions suitable for host device incorporation.
Solution Approach 2:
The patent transitions from a conventional planar PCB layout to a three-dimensional cavity substrate architecture. Electronic components are positioned within cavities and on multiple surfaces of the housing structure, utilizing vertical and lateral spaces within the housing walls. This dimensional transformation allows more components to be accommodated within the same footprint, resolving the contradiction between component integration and module size.
2Adaptability or versatility
If more electronic components are integrated to enable independent operation, then operational independence is improved, but camera module size increases
Solution Approach 1:
The patent combines multiple electronic components (ICD, memory chips, processors, resistors, capacitors, inductors) into a single integrated assembly mounted on the cavity substrate within the housing. By merging these components into one compact unit rather than distributing them across separate PCBs or external connections, the module achieves operational independence while maintaining a compact form factor that does not increase overall size.
Solution Approach 2:
The housing structure serves multiple functions simultaneously: it provides mechanical protection for the ICD, acts as a mounting substrate for electronic components, provides structural support for the lens assembly, and serves as the outer casing of the module. This multi-functionality allows operational independence to be achieved without adding dedicated components that would increase size.
3Volume of moving object
If electronic components are molded into housing walls to decrease size, then camera module size is decreased, but component integration is limited
Solution Approach 1:
The patent divides the housing structure into distinct regions including cavity spaces, walls, and surfaces, each serving as a separate mounting location for different electronic components. The cavity substrate is segmented into multiple cavities that can accommodate different component types. This segmentation allows a wide variety of components to be integrated throughout the housing structure rather than being limited to a single molded region, thereby increasing integration capability while maintaining compact size.
Solution Approach 2:
Different regions of the housing structure are designed with different properties and functions: cavity spaces for mounting electronic components, walls for providing structural support and additional mounting surfaces, and specific zones for optical path clearance. This local differentiation allows various components to be positioned in optimal locations throughout the housing, enabling complex component integration within a compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables higher image quality, independent operation, and increased component integration within a compact form factor, minimizing the impact on host device design and size.
Implementation Method 1
a flexible circuit substrate with multiple portions, including a rigid-flex printed circuit board and anisotropic conductive film
Data Source
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AI summary
A disclosed method of manufacturing a camera module includes providing an image capture device, providing an electronic component, providing a flexible circuit substrate, mounting the image capture device on a first portion of the flexible circuit substrate, mounting the electronic component on the second portion of the flexible circuit substrate, and positioning the second portion above the first portion. The method further includes providing a chip carrier including a bottom surface defining a cavity and a top surface adapted to receive the image capture device and positioning the chip carrier between the image capture device and the flexible circuit substrate. The method further includes mounting a second electronic component within the cavity.