Foldable Antenna Module Layout for Thin Electronic Housings
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Solution Overview
Problem
There is a demand for miniaturizing electronic devices while maintaining or enhancing their functionality, particularly in portable terminals, where internal components like antennas and batteries need to be efficiently arranged without increasing the device's thickness.
Innovation Solution
The electronic device incorporates a hinge structure with foldable housings, a flexible PCB connecting two PCBs, and an antenna module that overlaps the PCB perpendicularly, utilizing a base member with coil patterns and shielding layers to optimize space without increasing thickness, and includes vias for electrical connection and a heat dissipation layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If components are arranged in a conventional planar layout, then the device thickness can be reduced, but the internal space utilization is insufficient
Solution Approach 1:
The antenna module is arranged in a vertical direction perpendicular to the flexible PCB, transitioning from a conventional planar layout to a three-dimensional stacked configuration. This dimensional change allows the antenna to overlap the FPCB without increasing device thickness, while effectively utilizing the vertical space within the housing structure.
Solution Approach 2:
The antenna module is nested within the housing structure in the vertical direction, with the base member positioned between the display and the housing rear surface. The antenna overlaps the FPCB in the planar view, creating a nested arrangement where components occupy overlapping spatial regions without physical interference, thereby maximizing internal space utilization.
2Volume of moving object
If the antenna module is placed to overlap the FPCB, then space utilization is improved, but the FPCB may interfere with antenna performance
Solution Approach 1:
An overlapping area is defined on the antenna module where the second pattern layer is omitted, creating a dedicated space for the FPCB to pass through. This extraction of the pattern layer in a specific region allows the FPCB to be positioned between portions of the second pattern layer without significant interference to antenna performance, while maintaining overall space utilization.
Solution Approach 2:
The antenna module exhibits non-uniform structure with different regions serving different functions: the first pattern layer and most of the second pattern layer provide antenna functionality, while the overlapping area with the omitted second pattern layer provides a clear path for the FPCB. This local differentiation allows the FPCB to overlap the antenna module without compromising overall antenna performance.
3Volume of moving object
If multiple components are stacked vertically, then internal space is optimized, but heat dissipation becomes more difficult
Solution Approach 1:
A heat dissipation layer is introduced as an intermediary component between the antenna module and the housing structure. This heat dissipation layer facilitates thermal management in the vertically stacked configuration by providing a dedicated thermal conduction path, allowing heat generated by components to be efficiently dissipated without compromising the compact three-dimensional arrangement.
Data Source
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Figure 3A
AI summary
An electronic device is provided. The electronic device includes first and second printed circuit boards (PCBs); a flexible PCB (FPCB) connecting the first and second PCBs; and an antenna module between the first and second PCBs. The antenna module includes: a first pattern layer provided on a first substrate surface and forming a first coil pattern; a second pattern layer provided on a second substrate surface and forming a second coil pattern; an overlapping area in which the FPCB is provided between portions of the second pattern layer; and a plurality of pattern areas in which the portions of the second coil pattern are respectively provided