Foldable Driving Circuit Board With Through Holes For Narrow Bezel
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Solution Overview
Problem
As display devices increase in size and resolution, the length of the driving circuit board and the number of leads on the substrate increase, leading to reduced bending resistance and curvature, making it difficult to achieve a narrow bezel.
Innovation Solution
A foldable driving circuit board with through holes at the foldable portion, reducing the cross-sectional area and bending resistance, allowing for increased curvature and reduced bending radius, which is achieved by arranging through holes perpendicular to the folding direction and using a substrate with a thickness of 20 μm to 50 μm and a protective layer to prevent signal line damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the length of the driving circuit board is increased to accommodate larger display size and higher resolution, then the number of leads increases, but the bending resistance increases and bending radius increases, making it difficult to achieve narrow bezel
Solution Approach 1:
The driving circuit board is divided into multiple segments by forming through-holes that penetrate the substrate. These through-holes create separate regions that can bend independently, reducing the overall bending resistance and allowing for a smaller bending radius while maintaining electrical connectivity through the segmented structure.
Solution Approach 2:
The substrate is transformed into a porous structure by forming through-holes throughout its thickness. This porous configuration reduces the material volume in the bending region, thereby decreasing bending resistance and enabling the circuit board to achieve tighter bending radii necessary for narrow bezel designs.
2Manufacturing precision
If the number of leads on the display substrate is increased to improve resolution, then more signal lines are required, but the bending resistance increases, reducing the curvature of the foldable portion
Solution Approach 1:
The substrate is segmented into multiple regions by through-holes, allowing each segment to deform independently during bending. This segmentation reduces the overall stiffness of the structure, enabling higher curvature even with increased lead density required for high resolution displays.
Solution Approach 2:
The physical parameters of the substrate are modified by creating through-holes that change the structural stiffness and flexibility characteristics. This parameter change allows the substrate to achieve the required curvature for narrow bezel while supporting increased lead density for high resolution.
3Length of stationary object
If the thickness of the substrate is reduced to decrease bending radius, then the bending resistance decreases, but the signal lines become more vulnerable to damage
Solution Approach 1:
Protective layers are applied beforehand to the substrate surface before final assembly, providing cushioning and protection to the signal lines. This pre-protection ensures that even with reduced substrate thickness and increased flexibility, the signal lines remain protected from mechanical damage during bending and operation.
Solution Approach 2:
Thin protective films or encapsulation layers are applied to the substrate surface to protect the signal lines while maintaining the flexibility required for small bending radius. These thin film structures provide mechanical protection without significantly increasing the overall thickness or stiffness of the substrate.
Data Source
AI summary
There is disclosed a driving circuit board for a display device. The driving circuit board is foldable. The driving circuit board is provided with a through hole which penetrates through the driving circuit board and which is located at a foldable portion of the driving circuit board. The disclosure also provides a display device.