Foldable Circuit Layer for Stretchable Electronic Patches

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Solution Overview

Problem

Conventional wearable electronic patches face issues with comfort, durability, and breathability due to their rigid substrates, which make them uncomfortable to wear for extended periods and difficult to conform to curved surfaces, leading to discomfort and irritation from sweat buildup.

Innovation Solution

The development of highly compliant and stretchable electronic patches with a foldable circuit layer and elastic layer that can change shape to accommodate skin movements, featuring undulated ribbons and conductive circuits for wireless communication, and a breathable design to prevent moisture buildup.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If rigid polymer substrates are used for electronic patches, then structural stability is improved, but comfort and breathability deteriorate

Engineering Contradiction:
Improvestructural stabilityVSAvoidskin irritation from moisture buildup
Core Design Contradiction:
Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The patent replaces rigid polymer substrates with flexible and stretchable substrate materials that can conform to skin contours and accommodate skin movements. This flexible substrate maintains structural integrity while allowing breathability and moisture vapor transmission, eliminating skin irritation caused by rigid materials.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent employs composite material structures combining flexible substrates with stretchable electronic components, conductive materials, and breathable layers. This composite approach achieves both structural stability for circuit functionality and breathability for comfort, resolving the contradiction between rigidity and skin compatibility.

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If rigid substrates are used for electronic patches, then manufacturing precision is improved, but adaptability to curved surfaces deteriorates

Engineering Contradiction:
Improvecircuit assembly precisionVSAvoidconformability to curved surfaces
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent uses flexible substrates that can be manufactured with precise circuit patterns using standard flexible PCB techniques, then conform to curved skin surfaces through their inherent flexibility. This maintains manufacturing precision while achieving adaptability to body contours.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent incorporates stretchable electronic components and flexible circuits that can dynamically deform with skin movements and curvature changes. This dynamic flexibility allows the patch to adapt to various body surfaces while maintaining circuit functionality and assembly precision.

Inventive Principle:
Principle #15Dynamics

3Ease of manufacture

If conventional non-stretchable materials are used for electronic patches, then ease of manufacture is improved, but reliability under repeated elongation deteriorates

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoiddurability under repeated stretching
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent employs composite structures combining flexible substrates with stretchable electronic components, conductive elastomers, and elastic encapsulation layers. This composite design maintains manufacturing feasibility while providing reliability under repeated elongation through the inherent stretchability of each component.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the material parameters from rigid to flexible and stretchable, using materials with appropriate elastic moduli and elongation properties. This parameter change enables the patch to withstand repeated stretching during body movements while remaining manufacturable using adapted fabrication processes.

Inventive Principle:
Principle #35Parameter changes

4Object-affected harmful factors

If flexible substrates are used to improve comfort, then breathability is improved, but structural stability deteriorates

Engineering Contradiction:
Improvebreathability and moisture managementVSAvoidstructural stability
Core Design Contradiction:
Object-affected harmful factorsVSStability of the object's composition

Solution Approach 1:

The patent uses composite material structures where flexible substrates provide breathability and moisture vapor transmission, while integrated circuit boards and encapsulation layers provide structural stability. This composite approach achieves both comfort through breathability and structural integrity for electronic component support.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides increased durability and comfort by allowing the patches to stretch with skin movements while maintaining contact, reducing irritation through breathability and improved adhesion, thus enhancing user experience and patch longevity.

Implementation Method 1

an elastic layer that encloses the foldable circuit layer

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS9380698B1Stretchable electronic patch having a foldable circuit layer
Publication Date: 2016.06.28 VIVALNK
  • US9380698B1 patent drawing
  • US9380698B1 patent drawing
  • US9380698B1 patent drawing

AI summary

An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer. The electronic patch also includes an elastic layer that encloses the foldable circuit layer.