Foldable Digitizer Via-Hole Pattern for Rigidity
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Solution Overview
Problem
Foldable display devices face reliability issues due to non-uniform rigidity, which can lead to damage such as cracks during folding operations, particularly in the digitizer's folding region.
Innovation Solution
The implementation of a digitizer with via-holes that are strategically positioned to form closed curves and have a specific spacing and arrangement, ensuring uniform rigidity across the folding region, thereby preventing cracks and enhancing the device's reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If via-holes are densely arranged to ensure electrical connectivity in the folding region, then electrical connection reliability is improved, but structural rigidity deteriorates leading to cracks
Solution Approach 1:
The patent applies local quality by creating different via-hole arrangements in different regions: the folding region has via-holes with larger pitch (lower density) to maintain rigidity, while non-folding regions can have denser via-hole arrangements for optimal electrical connectivity. This regional differentiation resolves the contradiction between electrical reliability and structural strength.
Solution Approach 2:
The patent changes the parameter of via-hole pitch specifically in the folding region, increasing it to reduce stress concentration and prevent cracks. This parameter modification allows the structure to maintain sufficient electrical connectivity while avoiding the rigidity issues that would arise from dense via-hole arrangements in flexible regions.
2Strength
If via-holes are spaced far apart to maintain rigidity and prevent cracks, then structural strength is improved, but electrical connection reliability deteriorates
Solution Approach 1:
The patent implements local quality by applying different via-hole spacing strategies to different regions: larger pitch in folding regions for structural integrity, and optimized pitch in non-folding regions for electrical performance. This localized approach allows each region to optimize for its primary function.
Solution Approach 2:
The patent segments the digitizer into folding and non-folding regions with distinct via-hole patterns. This segmentation allows independent optimization of each region's via-hole arrangement, enabling the folding region to prioritize structural strength while other regions can prioritize electrical connectivity.
3Ease of manufacture
If uniform via-hole distribution is used across the entire digitizer, then manufacturing simplicity is improved, but non-uniform rigidity causes cracking in folding regions
Solution Approach 1:
The patent applies local quality by implementing region-specific via-hole patterns rather than uniform distribution. The folding region receives specialized treatment with larger pitch via-holes to ensure uniform rigidity and prevent cracks, while other regions can use standard patterns for manufacturing efficiency.
Solution Approach 2:
The patent segments the via-hole distribution pattern to match the functional segments of the display device. By dividing the digitizer into folding and non-folding regions with appropriate via-hole arrangements, it prevents the cracking issue in folding areas while maintaining manufacturability through standardized patterns in other regions.
Data Source
AI summary
A display device includes a display panel including a first non-folding region, a second non-folding region, and a folding region disposed between the first non-folding region and the second non-folding region, and a digitizer including a base layer, first conductive lines disposed on the base layer, a first cover layer disposed on the first conductive lines, second conductive lines disposed on the first cover layer, a second cover layer disposed on the second conductive lines. Via-holes pass through the first cover layer, a second conductive line of the second conductive lines is electrically connected to a first conductive line of the first conductive lines through the via-holes, and the via-holes overlap the folding region.