Foldable Digitizer Loop Layout With Via Holes for Uniform Sensing
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Solution Overview
Problem
Existing flexible display devices face issues with interference between wirings, reduced sensing uniformity, and unrecognized areas, which affect the reliability and manufacturing complexity of digitizers used in these devices.
Innovation Solution
A digitizer design featuring a base layer with specific openings and loop groups extending through via holes, which reduces interference and enhances sensing uniformity across the entire area, while simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If loops are arranged densely to improve sensing coverage, then sensing uniformity improves, but wiring interference increases
Solution Approach 1:
The patent introduces via holes that extend in the third dimension (vertical direction) through the base layer, allowing loops to connect across multiple layers. This dimensional transition enables loops to be distributed in three-dimensional space rather than confined to a single plane, reducing planar density and wiring interference while maintaining sensing coverage.
Solution Approach 2:
The base layer is divided into multiple segments with openings that create separate regions. Loops are distributed across these segmented regions and connected through via holes, which spatially separates the loops and reduces mutual interference while maintaining overall sensing uniformity across the display area.
2Object-generated harmful factors
If via holes are introduced to reduce wiring interference, then device complexity increases, but manufacturing precision requirements increase
Solution Approach 1:
The via holes are pre-defined in the base layer design with predetermined positions and dimensions. This preliminary structuring allows for standardized manufacturing processes where the via holes can be created using conventional photolithography and etching techniques, reducing the actual manufacturing precision requirements during production.
3Reliability
If loops extend through via holes to improve sensing coverage, then unrecognized areas are reduced, but device complexity increases
Solution Approach 1:
The via holes are embedded within the base layer structure, with loops nested around and through the via holes. This nesting approach integrates the via holes as part of the loop structure itself rather than as separate components, reducing overall device complexity while achieving improved sensing coverage and eliminating unrecognized areas.
Data Source
AI summary
A digitizer includes: a first base layer including a first non-folding area, a folding area contacting the first non-folding area, and a second non-folding area contacting the folding area, the first base layer defining a first opening in the folding area, a second opening on one side of the first opening in a first direction, and a first via hole between the first opening and the second opening in plan view; a first loop group including a plurality of loops having a long side extending in the first direction; and a second loop group including a plurality of loops having a long side extending in a second direction crossing the first direction. Some of the plurality of loops included in the first loop group may extend from a lower part of the first base layer to an upper part of the first base layer through the first via hole.