Foldable Display Back Panel Heat Dissipation Bridging

The heat dissipation layer is segmented into multiple independent thermally conductive members (first, second, and third thermally conductive members) spaced apart from each other. This segmentation allows each member to independently accommodate bending deformation without causing delamination or wrinkles, while collectively maintaining heat dissipation functionality across the folding region.

The patent employs thin film structures for the heat dissipation layer that can flexibly deform during folding. The thermally conductive members are designed as thin film elements that can bend without cracking, allowing the heat dissipation layer to adapt to the folding geometry while maintaining thermal conductivity and preventing display defects.

The third thermally conductive member positioned in the bending region acts as an intermediary that bridges the gap between the first and second thermally conductive members. This intermediary element maintains thermal conduction across the folding region without requiring the layer to be snapped, thus preserving heat conducting performance while avoiding display defects.

The patent extends the heat dissipation structure into the third dimension by spacing multiple thermally conductive members apart from each other in the thickness direction. This dimensional arrangement allows heat to conduct through multiple parallel paths, compensating for the gaps created by the folded structure and maintaining overall thermal performance.

The continuous graphite heat dissipation layer is divided into multiple discrete thermally conductive members spaced apart from each other. This segmentation eliminates the delamination and cracking issues associated with continuous layers during folding, as each discrete member can independently deform without constraining adjacent regions.

The heat dissipation layer is constructed as a composite structure comprising multiple thermally conductive members (potentially different materials or configurations) spaced apart and arranged in specific patterns. This composite approach combines the thermal conductivity benefits of graphite materials with the flexibility and structural stability of a distributed multi-component architecture.