Foldable Display Bottom Plate for Bubble Removal and Heat Dissipation
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Solution Overview
Problem
Electroluminescent display devices face issues with screen defects due to bubbles generated during the lamination process and heat dissipation challenges, particularly in foldable display devices.
Innovation Solution
A foldable display device design incorporating a bottom plate with folding patterns and aperture patterns that facilitate bubble removal and enhanced heat dissipation, utilizing a stacked metal structure with varying hole patterns to improve adhesion and reduce heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a lamination process is used to bond the display module, then bonding strength is improved, but bubbles are generated causing screen defects
Solution Approach 1:
The bottom plate is segmented with multiple aperture patterns (first aperture patterns and second aperture patterns) that divide the bonding area into regions, allowing bubbles to escape through these segmented pathways during the lamination process while maintaining bonding strength in the remaining areas
Solution Approach 2:
The harmful bubbles are extracted from the bonding process by providing dedicated escape pathways through the aperture patterns in the bottom plate, allowing bubbles to be removed from the bonding interface without compromising the overall bonding strength
2Power
If circuit components are heated for operation, then display function is improved, but heat accumulation causes afterimage phenomenon
Solution Approach 1:
The bottom plate has different local qualities with first aperture patterns in regions corresponding to circuit components and second aperture patterns in other regions, creating localized heat dissipation pathways where heat is generated while maintaining structural integrity in other areas
Solution Approach 2:
The heat that would normally cause afterimage phenomenon is converted into a beneficial effect by using the aperture patterns as heat dissipation pathways, allowing the heat to be efficiently removed through the bottom plate to the system middle frame, thus preventing afterimage while maintaining display performance
3Strength
If a solid bottom plate structure is used, then structural strength is improved, but heat dissipation is reduced
Solution Approach 1:
The bottom plate is designed with a porous structure containing multiple aperture patterns that provide heat dissipation pathways while maintaining overall structural strength, effectively combining the benefits of solid structure with heat dissipation capabilities
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents screen defects by removing bubbles and enhances heat dissipation, increasing the lifespan and reducing power consumption of the display device.
Implementation Method 1
bubbles generated during the lamination process can cause screen defects, so a bubble removal method is required
Implementation Method 2
The display device may have an afterimage phenomenon caused by the heating of circuit components, so a heat dissipation plan is required
Data Source
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AI summary
Disclosed is a display device in which bubbles generated in a bonding process of a display module can be eliminated, which comprises a foldable display device comprising a system middle frame capable of folding relative to a folding axis, and a foldable display module having a folding area that is bonded with the system middle frame and capable of folding relative to the folding axis, and a plurality of flat areas connected through the folding area, wherein the foldable display module comprises a display panel including the plurality of flat areas and the folding area, and a bottom plate that is bonded between the display panel and the system middle frame and includes a plurality of folding patterns disposed in the folding area and a plurality of aperture patterns disposed in the plurality of flat areas.