Foldable Display Circuit Board IC Positioning

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

In foldable display devices, driving integrated circuits (ICs) on flexible printed circuit boards often contact each other during bending, leading to potential damage and functionality issues.

Innovation Solution

The design includes a folding area with recessed indented portions and folding holes in the circuit board, ensuring that driving ICs in the first and second unfolding areas do not overlap in the thickness direction, preventing direct contact and enhancing flexibility during folding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If driving ICs are disposed on a flexible printed circuit board in a foldable display device, then the display device can be folded to provide a larger screen, but the driving ICs may contact each other during bending causing potential damage

Engineering Contradiction:
ImprovefoldabilityVSAvoiddriving IC contact prevention
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent positions driving ICs in different unfolding areas (first and second unfolding areas) such that they do not overlap in the thickness direction during folding. This spatial arrangement in three-dimensional space prevents contact while maintaining foldability, directly resolving the contradiction between adaptability and reliability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Strength

If the circuit board is made rigid to support driving ICs, then the ICs are protected from damage, but the display device cannot be folded

Engineering Contradiction:
Improvecircuit board rigidityVSAvoidfoldability
Core Design Contradiction:
StrengthVSAdaptability or versatility

Solution Approach 1:

The circuit board is divided into distinct functional areas: folding area, first unfolding area, and second unfolding area. The driving ICs are placed in the unfolding areas where rigidity is maintained, while the folding area remains flexible. This segmentation allows the board to be both strong where needed and foldable where required.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the circuit board have different mechanical properties. The unfolding areas maintain rigidity to support driving ICs, while the folding area is designed to be flexible. This local differentiation of material properties resolves the contradiction between overall rigidity and local foldability.

Inventive Principle:
Principle #3Local quality

3Area of stationary object

If driving ICs are placed close together to save space, then the device size is reduced, but the ICs may contact each other during folding

Engineering Contradiction:
Improvecircuit board areaVSAvoiddriving IC separation
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

Instead of increasing separation distance in the planar direction (which would waste space), the patent utilizes the thickness direction by positioning ICs in different unfolding areas. This three-dimensional spatial arrangement maintains compact device size while preventing IC contact during folding.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11758663B2Display device
Publication Date: 2023.09.12 SAMSUNG DISPLAY CO LTD
  • US11758663B2 patent drawing
  • US11758663B2 patent drawing
  • US11758663B2 patent drawing

AI summary

A display device includes a folding area, a first unfolding area located on a side of the folding area, and a second unfolding area located on a second side of the folding area. The display device further includes a display module which includes a display panel, and a first circuit board which is attached to the display panel and disposed under the display module, wherein the first circuit board includes a base film, a first driving integrated circuit (“IC”) disposed in the first unfolding area, and a second driving IC disposed in the second unfolding area where the first driving IC and the second driving IC do not overlap each other in a thickness direction during folding.