Foldable Display Cover Structure for Stress-Balanced Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenges of improving the lifespan and reliability of foldable display devices in electronic devices, particularly in terms of deformability and display performance, have not been adequately addressed by existing technologies.
Innovation Solution
A foldable display device design incorporating a cover structure with specific thickness ratios and adhesive layers between substrates to enhance durability and reliability, including a first substrate, a second substrate, and adhesives, with controlled thicknesses and materials to manage stress and folding, and a release layer for easy detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a foldable display device is designed with traditional cover structure, then the device can achieve basic folding function, but the lifespan and reliability are insufficient
Solution Approach 1:
The cover structure is divided into multiple substrates (first substrate, second substrate, third substrate, fourth substrate) with distinct functions. Each substrate layer contributes to different aspects of protection and flexibility, allowing the system to achieve high reliability through distributed functionality rather than a single complex component
Solution Approach 2:
The patent employs a composite structure combining multiple substrate materials and adhesive layers with specific thickness ratios. The first substrate and second substrate are bonded via first adhesive, while the third substrate and fourth substrate are bonded via third adhesive, creating a multi-material composite that balances rigidity and flexibility for improved lifespan
2Strength
If the cover structure uses thicker substrates for strength, then protection against external forces improves, but the folding deformability decreases
Solution Approach 1:
The patent specifies precise thickness parameters for each substrate and adhesive layer, with the ratio of (thickness of first substrate + thickness of first adhesive) to (thickness of first substrate + thickness of first adhesive + thickness of second substrate) controlled within 0.3 to 0.7. This parameter optimization ensures each layer contributes appropriately to both strength and flexibility
Solution Approach 2:
Different substrate layers are designed with different thicknesses and material properties suited to their specific functions. The first substrate and second substrate serve different protective roles, allowing localized optimization of strength where needed while maintaining overall deformability through thinner regions
3Strength
If adhesive layers are made thicker for better adhesion, then bonding strength improves, but the overall structure becomes less flexible
Solution Approach 1:
The adhesive layer thickness is precisely controlled as a critical parameter. The first adhesive thickness is optimized to provide sufficient bonding strength between substrates while the second adhesive thickness is controlled to maintain overall structure flexibility during folding operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the folding effect, reliability, and lifespan of foldable display devices by providing stress balance and protection against external forces, while maintaining optical performance and adhesion, thus improving the overall product characteristics.
Implementation Method 1
The first adhesive is disposed between the first substrate and the second substrate. The second adhesive is disposed between the electronic structure and the cover structure
Data Source
AI summary
An electronic device is provided by the present disclosure and includes an electronic structure, a cover structure, and a second adhesive. The cover structure is adhered to the electronic structure and includes a first substrate, a second substrate, and a first adhesive. The first adhesive is disposed between the first substrate and the second substrate. The second adhesive is disposed between the electronic structure and the cover structure, and the first substrate is disposed between the first adhesive and the second adhesive. The electronic structure includes an electronic layer and a substrate structure, and the electronic layer is disposed between the substrate structure and the cover structure. The substrate structure includes a third substrate, a third adhesive, and a fourth substrate. The third adhesive is disposed between the third substrate and the fourth substrate, and the third substrate is disposed between the third adhesive and the electronic layer.