Foldable Display Support Plate Layout for Crease Reduction

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Solution Overview

Problem

Foldable display modules suffer from crease formation in the bending area due to uneven stress distribution, which hampers market adoption.

Innovation Solution

A foldable display module design featuring alternating hole groups with varying lengths and arrangements of via holes, including first and second hole groups with specific spacer parts, to evenly distribute bending stress and reduce material usage, enhancing support performance and stress release paths.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a conventional support plate structure is used in the bending area, then the structure is simple and easy to manufacture, but the stress distribution is uneven causing obvious creases

Engineering Contradiction:
Improvestress distribution uniformityVSAvoidsupport plate structure complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The support plate is segmented into multiple hole groups with different configurations (first hole groups with longer via holes, second hole groups with shorter via holes, third hole groups with partial via holes). This segmentation allows different regions to handle stress differently, creating uniform stress distribution across the bending area while maintaining manufacturability through standardized hole patterns.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the support plate are given different local qualities through varying hole depths and arrangements. The first hole groups have deeper via holes for areas needing more stress relief, while second and third hole groups have shallower via holes for areas requiring less intervention. This local differentiation resolves the contradiction by providing exactly the right stress management in each location without uniformly complicating the entire structure.

Inventive Principle:
Principle #3Local quality

2Reliability

If via holes of uniform length are used in the support plate, then the manufacturing process is simple, but the bending stress is not released evenly leading to crease formation

Engineering Contradiction:
Improvecrease resistanceVSAvoidvia hole manufacturing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The via holes are segmented into three categories based on depth: first via holes (deeper) in first hole groups, second via holes (shorter) in second hole groups, and third via holes (partial depth) in third hole groups. This segmentation enables differentiated stress release at various locations, improving crease resistance while the modular approach keeps manufacturing manageable through standardized hole patterns.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The key parameter changed is the via hole depth, which varies across different hole groups. First via holes extend deeper into the support plate for maximum stress relief, while second and third via holes are shallower for localized stress management. This parameter variation directly addresses crease resistance by creating uniform stress distribution, while the manufacturing complexity is controlled by limiting the variation to just three standardized depth levels.

Inventive Principle:
Principle #35Parameter changes

3Strength

If the support plate has high rigidity to maintain structural integrity, then the device is stable, but stress concentration occurs in the bending area causing creases

Engineering Contradiction:
Improvesupport plate rigidityVSAvoidbending stress concentration
Core Design Contradiction:
StrengthVSStress or pressure

Solution Approach 1:

The support plate structure is segmented with strategically placed hole groups that create stress release pathways without compromising overall rigidity. The first hole groups with deeper via holes provide primary stress relief, while second and third hole groups provide secondary relief, allowing the plate to maintain structural integrity while distributing bending stresses uniformly across the bending area.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support plate incorporates a porous-like structure through the array of via holes of varying depths. This porous configuration allows stress to distribute more evenly throughout the material by providing multiple stress release pathways, reducing stress concentration in the bending area while maintaining sufficient rigidity for structural support.

Inventive Principle:
Principle #31Porous materials

Data Source

PatentUS12572168B2Foldable display modules and foldable display devices
Publication Date: 2026.03.10 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
  • US12572168B2 patent drawing
  • US12572168B2 patent drawing
  • US12572168B2 patent drawing

AI summary

The present disclosure provides foldable display modules and foldable display devices. The foldable display module includes a display panel and a support plate. The support plate includes first hole groups and second hole groups alternately arranged along a second direction. The first hole group includes a plurality of first via holes, and the second hole group includes a plurality of second via holes. In a first direction, a length of the first via hole is greater than a length of the second via hole, and the second via holes are arranged corresponding to first spacer parts each located between two adjacent first via holes.