Foldable Display Panel Driver Circuit Relocation
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Solution Overview
Problem
Foldable display devices face a significant challenge in maintaining service life due to the bending resistance issues in the foldable area, where metal wirings are prone to fracture, limiting their usability and durability.
Innovation Solution
The design incorporates a foldable area without driver circuits, featuring interconnected through holes and a connection line layer to enhance bending resistance, while non-foldable areas house driver circuits to drive pixel groups, improving flexibility and longevity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If driver circuits are located in the foldable area to drive pixel groups, then the display device can achieve full screen coverage, but the metal wirings in the foldable area are prone to fracture and service life is seriously affected
Solution Approach 1:
The display panel is divided into a foldable area and non-foldable areas. Driver circuits are segmented and relocated to the non-foldable areas, separating the bending region from the electronic component region. This segmentation allows the foldable area to be dedicated to display functions while non-foldable areas house driver circuits, eliminating wiring fracture risks in the bend zone.
Solution Approach 2:
Driver circuits are extracted from the foldable area and placed in non-foldable areas. This extraction removes the problematic metal wirings from the bending region, preventing fracture while maintaining full-screen display capability through proper spatial arrangement of remaining components.
2Reliability
If driver circuits are relocated to non-foldable areas to prevent wiring fracture, then service life is improved, but the device complexity increases due to separate driver circuit arrangements
Solution Approach 1:
Multiple driver circuits are merged into the non-foldable areas, consolidating electronic components in a dedicated region. This merging approach, combined with the through-hole connection structure, manages complexity by creating a unified non-foldable zone that houses all driver circuits, simplifying the overall layout compared to distributed arrangements.
Solution Approach 2:
Through holes serve as intermediaries connecting the foldable display area with the non-foldable driver circuit area. These interconnected through holes enable signal transmission between regions without requiring complex wiring in the bend zone, acting as a mediator that simplifies the connection architecture.
3Strength
If interconnected through holes are created in the foldable area to support driver circuits, then bending resistance is enhanced, but the manufacturing precision requirements increase
Solution Approach 1:
The through holes are nested within the driver device layer structure, with the first inorganic insulation layer patterned to form holes that interconnect with through holes in subsequent layers. This nested arrangement integrates the through holes into the existing manufacturing process flow, reducing additional precision requirements compared to standalone through-hole structures.
Solution Approach 2:
The first inorganic insulation layer is prepared and patterned in advance to form through holes before final driver circuit assembly. This preliminary action establishes the through-hole architecture early in the manufacturing process, allowing subsequent layers to be aligned to predetermined hole positions, thereby reducing final alignment precision requirements.
Data Source
AI summary
A foldable display panel and a method for preparing the foldable display panel. The foldable display panel includes a foldable area and a plurality of non-foldable areas located at both sides of the foldable area in a width direction of the foldable display panel. The foldable display panel includes: a plurality of pixel groups, including a plurality of first pixel groups located in the foldable area and a plurality of second pixel groups located in the plurality of non-foldable areas; a plurality of driver circuits located in the plurality of non-foldable areas and for driving the plurality of pixel groups. The plurality of driver circuits include a plurality of first driver circuits for driving the plurality of first pixel groups and a plurality of second driver circuits for driving the plurality of second pixel groups.