Foldable Display Heat Conduction via Segmented Hinge Members
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Solution Overview
Problem
Foldable electronic devices face increased internal temperatures due to reduced exposed surfaces when folded, leading to decreased heat dissipation performance compared to their unfolded state.
Innovation Solution
Incorporating a hinge assembly with flexible printed circuit boards (FPCBs) and heat conduction members between the hinge assembly and the display, which form heat conduction paths to distribute heat effectively throughout the device, even when folded.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the display is folded to enable foldable device functionality, then device versatility is improved, but the exposed surface area is reduced leading to increased internal temperature
Solution Approach 1:
The heat conduction members are divided into multiple segments including first heat conduction members connected to the first display area, second heat conduction members connected to the second display area, and third heat conduction members connecting the hinge assembly to both heat conduction member sets. This segmented structure enables heat to be distributed across multiple pathways throughout the device rather than concentrated in one area, effectively managing temperature when the device is folded.
Solution Approach 2:
The hinge assembly is equipped with heat conduction members that act as intermediary heat transfer paths. These members connect the hinge assembly to the first and second heat conduction members, facilitating heat transfer from the hinge area to the display areas. This intermediary structure ensures that heat generated in the hinge region can be effectively distributed to the display surfaces for dissipation.
2Temperature
If heat conduction members are added to the hinge assembly, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The heat conduction members serve multiple functions: they provide structural support connecting the hinge assembly to the display areas, establish thermal pathways for heat dissipation, and maintain mechanical integrity during folding operations. By making these components multi-functional, the patent avoids adding separate dedicated heat dissipation structures, thereby limiting the increase in device complexity.
Solution Approach 2:
The heat conduction members are integrated into the existing hinge assembly structure rather than being added as separate components. The first, second, and third heat conduction members are combined with the hinge assembly to form a unified structure that performs both mechanical and thermal functions, reducing overall device complexity compared to having separate heat dissipation components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation performance by maintaining efficient heat transfer and distribution across the device, minimizing temperature differences between folded and unfolded states.
Implementation Method 1
a plurality of front heat conduction members forming a heat conduction path between the hinge assembly and the display
Data Source
AI summary
An electronic device is provided. The electronic device includes a display including a first area and a second area, a first housing forming a first space positioned on a rear surface of the first area, a second housing forming a second space positioned on a rear surface of the second area, a hinge assembly for causing the first area and the second area to be in a first state of forming substantially the same plane or to be in a second state of facing each other, and a plurality of front heat conduction members forming a heat conduction path between the hinge assembly and the display.