Foldable Display Mounting Structure Without Welding Mold Marks
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Solution Overview
Problem
Conventional foldable electronic devices experience surface deformation and mold marks due to local overheating during the welding process, affecting user experience and product quality.
Innovation Solution
A foldable electronic device with a flexible display mounted using a thermosetting resin layer, which eliminates the need for high-temperature welding, ensuring no surface deformation and providing a reliable, lightweight, and cost-effective connection method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If laser welding is used to fix the nut to the metal sheet, then the connection strength is improved, but local overheating causes deformation of the metal sheet and mold marks on the foldable display
Solution Approach 1:
The patent replaces the welding process (thermal/chemical system) with a mechanical pressing and adhesive bonding system. The pressing device applies mechanical pressure to embed the connecting piece into the adhesive layer, which is then heated to a curing temperature (not welding temperature) to complete the bonding. This substitution eliminates the localized high-temperature welding process that causes overheating, deformation, and mold marks, while still achieving strong connections through mechanical embedding and adhesive bonding.
Solution Approach 2:
The patent fundamentally changes the temperature parameter from welding temperatures (typically above 1000°C) to adhesive curing temperatures (typically 50-150°C). This parameter change eliminates the thermal damage to the metal sheet and foldable display while maintaining connection strength through the adhesive bonding process. The pressing force parameter is introduced to ensure proper embedding of the connecting piece into the adhesive layer.
2Reliability
If welding process is used to mount the foldable display, then the mounting reliability is improved, but the high temperature causes surface deformation and mold marks
Solution Approach 1:
The patent replaces the welding process with a mechanical pressing and adhesive bonding system. The pressing device mechanically embeds the connecting piece into the adhesive layer, and subsequent heating cures the adhesive to create a reliable bond. This mechanical-chemical bonding process eliminates the high-temperature welding that causes surface deformation and mold marks on the foldable display, while maintaining mounting reliability through the combined mechanical embedding and adhesive bonding.
3Strength
If conventional welding method is used, then the connection is strong, but the production cost and complexity increase due to overheating control issues
Solution Approach 1:
The patent replaces the complex welding process with a simpler mechanical pressing and adhesive bonding process. The pressing device applies controlled mechanical pressure to embed the connecting piece, and a subsequent heating step cures the adhesive. This eliminates the need for complex welding parameter control, overheating prevention measures, and post-welding surface treatment, thereby reducing process complexity while maintaining connection strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents surface deformation and mold marks, enhances user experience, reduces production costs, and improves product competitiveness by using a thermosetting resin layer for connecting the flexible display to the support mechanical part.
Implementation Method 1
the connecting piece is fixed to the support mechanical part by using a thermosetting resin layer
Implementation Method 2
In a process of forming the thermosetting resin layer, no excessively high temperature is required
Data Source
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AI summary
This application provides a foldable electronic device and a foldable display mounting structure. The foldable electronic device includes a housing and a middle frame, where an electronic element is disposed in the housing, and the foldable electronic device further includes: a foldable display, where the foldable display is flexible and bendable, the foldable display includes a flexible cover and a flexible displaying module, and the flexible displaying module displays through the flexible cover; a support mechanical part, where the support mechanical part is fixedly connected to the foldable display, the support mechanical part is located on a side, facing the housing, of the foldable display, and is configured to support the foldable display; and at least one connecting piece, where the connecting piece is fixed to the support mechanical part by using a thermosetting resin layer, the connecting piece is fixedly connected to the middle frame of the electronic device, and is configured to mount the foldable display and the support mechanical part on the electronic device. In a process of using the foldable electronic device provided in this application, no mold mark or convex hull is generated on a surface of the foldable display.