Foldable Display Panel Bonding With Resin-Filled Connection Holes
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Solution Overview
Problem
Existing display devices face challenges in maintaining adequate adhesive force between the display panel and the connection substrate, leading to increased defect rates.
Innovation Solution
Incorporating resin layers in specific holes of the connection substrate that overlap the display panel, such as the second and third holes, to enhance adhesive force, thereby reducing the need for a cover film and minimizing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive force between display panel and connection substrate is improved by adding resin layers, then reliability is improved, but device complexity increases
Solution Approach 1:
The connection substrate is divided into multiple functional areas with different hole patterns: a first area with no holes for strong adhesion, a second area with periodically arranged holes for controlled adhesion, and a third area with through-holes for mechanical interlocking. This segmentation allows each region to contribute differently to the overall adhesive force while maintaining a relatively simple overall structure.
Solution Approach 2:
Different regions of the connection substrate are designed with different hole configurations to provide locally optimized adhesion properties. The first area uses a solid structure for maximum bonding, the second area uses periodic holes for balanced adhesion and flexibility, and the third area uses through-holes for enhanced mechanical interlocking. This local differentiation improves reliability without requiring complex structures throughout the entire device.
2Area of stationary object
If the non-display area surface area is reduced, then area efficiency is improved, but adhesive force deteriorates
Solution Approach 1:
The connection substrate incorporates periodic hole patterns in the second area and through-holes in the third area, creating a porous structure that increases adhesion through surface area multiplication and mechanical interlocking. This allows adequate adhesive force to be achieved even when the overall non-display area is reduced, as the effective bonding surface area is enhanced by the hole structures.
Solution Approach 2:
The connection substrate combines regions of solid material with regions containing periodic holes and through-holes, creating a composite structure that optimizes both adhesion and area efficiency. The combination of different structural patterns in different areas allows the design to achieve strong bonding while minimizing the total non-display area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The increased adhesive force between the display panel and connection substrate reduces defect rates by ensuring reliable fixation without the need for a cover film, even with reduced non-display area surface area.
Implementation Method 1
Incorporating resin layers in specific holes of the connection substrate that overlap the display panel to enhance adhesive force
Data Source
AI summary
A display device includes: a display panel including a first area, a second area formed to be bendable from the first area, and a third area extending from the second area; a driving chip in the third area; a connection substrate including a first hole overlapping the driving chip and a second hole overlapping the third area, and overlapping at least a portion of the third area; and a first resin layer in the second hole.