Foldable Display Spacer Structure for Driving Chip Heat Dissipation
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Solution Overview
Problem
Conventional bendable display devices face challenges in heat radiation, leading to potential overheating and reliability issues due to inadequate thermal management systems.
Innovation Solution
A display device design incorporating a spacer with a base layer of high thermal conductivity, such as copper or graphite, and a support layer with metal, along with an adhesive layer and heat radiation layer, to effectively dissipate heat generated by the driving chip when the display panel is folded or unfolded.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional thermal management system is used in bendable display devices, then the device structure remains simple, but heat radiation is insufficient leading to overheating and reliability issues
Solution Approach 1:
The patent combines multiple thermal management functions into a single integrated spacer structure. The spacer integrates the heat radiation layer, support function, and spacing function into one component, eliminating the need for separate thermal management systems while achieving effective heat dissipation and improving device reliability
Solution Approach 2:
The spacer is designed as a multi-functional component that simultaneously provides thermal management (heat radiation), mechanical support, and spacing functions. This universal design reduces overall device complexity while addressing thermal issues through the integrated heat radiation layer with high thermal conductivity materials
2Temperature
If a spacer with high thermal conductivity base layer is added to improve heat radiation, then thermal management efficiency increases, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent applies local quality by using high thermal conductivity materials (such as metal materials with thermal conductivity of 10 W/mK or more) specifically in the heat radiation layer and base layer of the spacer, while other parts of the display device use conventional materials. This targeted approach improves heat radiation efficiency without requiring all components to be manufactured with special materials
Solution Approach 2:
The spacer employs composite material structure with a base layer made of high thermal conductivity material (metal, copper, aluminum, or graphite) combined with other materials in different layers. This composite approach optimizes thermal management while maintaining manufacturability through established composite material fabrication techniques
3Temperature
If the spacer overlaps the driving chip when folded to improve heat dissipation, then thermal management improves, but the risk of damage to the driving chip increases
Solution Approach 1:
The spacer acts as an intermediary component between the driving chip and the heat radiation layer. It provides a controlled thermal pathway that dissipates heat while its structural design (with appropriate thickness and material properties) protects the driving chip from direct contact and potential damage during the folding operation
Solution Approach 2:
The spacer provides beforehand cushioning by creating a protective barrier and controlled compression zone between the driving chip and external forces during folding. This cushioning effect prevents direct impact on the driving chip while maintaining effective thermal contact for heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat radiation properties, preventing overheating and improving the reliability and portability of bendable display devices by efficiently managing thermal dissipation.
Implementation Method 1
a base layer disposed between the upper layer and the lower layer and having a thermal conductivity greater than a thermal conductivity of the upper layer and a thermal conductivity of the lower layer
Implementation Method 2
a heat radiation layer disposed on the lower surface of the first area of the display panel
Data Source
AI summary
A display device includes a display panel including a first area, a bending area, and a second area, and comprising a plurality of pixels disposed in the first area, a driving chip disposed on an upper surface of the second area of the display panel and electrically connected to the plurality of pixels, a support layer disposed on a lower surface of the first area of the display panel, and a spacer disposed on the lower surface of the first area and overlapping the support layer in a plan view, wherein the spacer comprises an upper layer, a lower layer, and a base layer having a thermal conductivity greater than a thermal conductivity of the upper layer and a thermal conductivity of the lower layer, and in case that the bending area of the display panel is folded, the spacer overlaps the driving chip in a plan view.