Foldable Display Hinge and Thermal Layout for Wrinkle-Free Thinness
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Solution Overview
Problem
Foldable display apparatuses face challenges in minimizing folding wrinkles, maintaining rigidity in the in-folding state, blocking heat transfer from integrated circuits, and reducing thickness while ensuring effective heat dissipation.
Innovation Solution
A foldable display apparatus design featuring a panel assembly with a hinge device, an in-folding hinge assembly, and a heat dissipation sheet, where the heat dissipation sheet is strategically placed between different height parts of the bottom plate to prevent heat transfer and maintain thinness, and a roller assembly to secure the unfolding state, along with a coupling structure for miniaturization and rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional hinge structure is used, then the device can be folded, but folding wrinkles occur on the panel
Solution Approach 1:
A buffer plate is introduced as an intermediary component between the hinge assembly and the panel. This buffer plate absorbs the mechanical stress and deformation during folding operations, preventing direct transmission of folding forces to the panel surface, thereby eliminating folding wrinkles while maintaining foldability
2Volume of moving object
If the hinge device is made compact, then the thickness is reduced, but rigidity in in-folding state decreases
Solution Approach 1:
The hinge device employs a composite structure combining multiple materials with different properties - rigid components for structural support and flexible components for motion. This composite construction allows the hinge to maintain small volume while achieving sufficient rigidity in the in-folding state through the synergistic combination of material properties
3Volume of moving object
If integrated circuit is placed close to panel, then device thickness is reduced, but heat transfer to panel increases
Solution Approach 1:
A heat dissipation sheet is positioned as an intermediary layer between the integrated circuit and the panel. This heat dissipation sheet acts as a thermal management interface that conducts heat away from the panel while maintaining the compact thickness of the overall device structure
4Volume of moving object
If the bottom plate is made thin, then device thickness is reduced, but heat dissipation capability decreases
Solution Approach 1:
The bottom plate utilizes composite material construction with high thermal conductivity materials strategically positioned to maximize heat dissipation pathways. This allows the plate to maintain reduced thickness while compensating for the decreased thermal mass through optimized material composition and heat transfer geometry
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively eliminates folding wrinkles, maintains rigidity, prevents heat transfer to the panel, and reduces the overall thickness of the display apparatus while ensuring effective heat dissipation and structural integrity.
Implementation Method 1
a heat dissipation sheet is disposed in the accommodation space... heat generated by the integrated circuit may be prevented from being transferred to the panel
Data Source
AI summary
The disclosure provides a foldable display apparatus. The foldable display apparatus is capable of folding or unfolding. According to the disclosure, the foldable display apparatus includes a bottom plate that may include a first part having a first height and a second part having a second height; an up-down plate having a length in an axial direction; and a roller assembly including a roller and a roller stopper.


