Foldable Display Assembly Layout for Thin Device Packaging
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Solution Overview
Problem
Existing electronic devices face challenges in accommodating electronic components on a drive board while achieving lightening and thinning, particularly in foldable devices where space is limited.
Innovation Solution
The interface component is positioned on a surface of the circuit board facing away from the display screen, allowing for an enlarged spacing that accommodates the drive board and interface component within the first middle frame, with the middle frame's structure adapted to form a cavity for assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the drive board is moved from the second middle frame into the first middle frame to improve lightening and thinning, then the device thickness is reduced, but the electronic component on the drive board cannot be accommodated in the first middle frame
Solution Approach 1:
The accommodating cavity is formed within the first middle frame by utilizing the space between the circuit board and the drive board. The electronic component is nested within this cavity, effectively using the available volume without increasing the overall device thickness. This nesting approach allows the electronic component to be housed within the existing structural envelope.
Solution Approach 2:
The interface component is positioned on the surface of the circuit board facing away from the display screen, utilizing the Z-dimension (thickness direction) to create spacing. This dimensional arrangement enables the formation of the accommodating cavity in the thickness direction, allowing the electronic component to be positioned without increasing the device's planar footprint.
2Volume of moving object
If the interface component is positioned on the surface of the circuit board facing away from the display screen to accommodate electronic components, then the electronic component can be assembled in the first middle frame, but the spacing requirement may increase device complexity
Solution Approach 1:
The first middle frame serves multiple functions: it provides structural support, houses the circuit board, accommodates the drive board, and contains the accommodating cavity for the electronic component. The interface component positioned on the circuit board surface also serves dual purposes for electrical connection and spatial organization. This multi-functionality reduces the need for additional specialized structures.
Solution Approach 2:
The accommodating cavity is formed by integrating the space between existing components (circuit board and drive board) rather than adding a separate housing structure. The interface component positioning strategy merges the electrical connection function with the spatial organization function, creating the accommodation space as a byproduct of the component arrangement rather than requiring a dedicated structure.
Data Source
AI summary
An electronic device, including a circuit board, an interface component, a housing, and a first display screen. The housing includes a first middle frame and a second middle frame that are rotatably connected to each other. The first middle frame has an accommodation cavity and a plug-in interface. The circuit board is located in the accommodation cavity. The interface component is inserted in the plug-in interface and is electrically connected to the surface of the circuit board facing away from the first display screen. A drive board is provided on a side of the first display screen facing the first middle frame. An electronic component group including at least one electronic component is provided on the drive board. The first middle frame has an accommodating cavity on a side facing the first display screen. The electronic component group is located in the accommodating cavity.