Foldable Display Wiring Layout for Crack-Resistant Bending Areas
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Solution Overview
Problem
Organic light-emitting display apparatuses face issues with wiring cracking in bending areas, which can lead to structural failure and reduced durability.
Innovation Solution
The display apparatus incorporates a design with a substrate, inorganic insulating layer, and organic layers to create a robust structure that minimizes cracking in bending areas, featuring connection wires with specific metal patterns and organic layers to enhance flexibility and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the display apparatus uses a bending area in the peripheral region to enable flexibility and foldability, then adaptability and versatility are improved, but wiring cracking occurs in the bending area leading to reduced reliability
Solution Approach 1:
The patent applies flexible thin film structures by removing the inorganic insulating layer from the bending area and using organic insulating layers instead, which have better flexibility and can withstand repeated bending without cracking. This allows the display apparatus to be folded or bent while maintaining wiring integrity.
Solution Approach 2:
The inorganic insulating layer is extracted or removed from the bending area specifically, while remaining in other areas. This selective removal eliminates the source of cracking in the bending region while preserving the insulating function where rigid structure is needed.
2Reliability
If the inorganic insulating layer is removed from the bending area to prevent wiring cracking, then reliability is improved, but manufacturing complexity increases due to selective layer removal
Solution Approach 1:
The insulating layer structure is segmented into different regions: the inorganic insulating layer is removed from the bending area while remaining in non-bending areas, and organic insulating layers are applied selectively. This segmentation allows differential treatment of different functional regions to optimize both reliability and manufacturability.
3Reliability
If organic insulating layers are used instead of inorganic layers in the bending area, then wiring cracking is reduced improving reliability, but manufacturing precision requirements increase for layer alignment and formation
Solution Approach 1:
The material parameter of the insulating layer is changed from inorganic to organic in the bending area. Organic materials have different physical properties including flexibility and conformability that reduce cracking, though they require precise control during formation processes to maintain proper layer alignment and thickness.
Data Source
AI summary
A display apparatus in which wiring in a bending area cracks less includes a substrate including a display area, a peripheral area, and a bending area which is at least a portion of the peripheral area that is bendable, an inorganic insulating layer arranged on the substrate and overlapping the display area and the peripheral area and defining an opening, a pixel circuit in the display area, a planarization insulating layer on the pixel circuit, a pad portion on an end of the peripheral area, a first organic layer arranged in the bending area and including the same material as a material included in the planarization insulating layer, and a connection wire extending on the pad portion. The connection wire includes first metal patterns under the first organic layer, and second metal patterns on the first organic layer and electrically connected to the first metal patterns.