Foldable Fabric-Based Semiconductor Package for Wearable Wireless Charging

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Solution Overview

Problem

Conventional wireless charging solutions for electronic devices are inconvenient, as they often require users to remain stationary, are costly to manufacture, and may have suboptimal performance for size-critical applications, with some solutions relying on energy harvesting from the user which can be unpredictable and inefficient.

Innovation Solution

A foldable fabric-based semiconductor package (FFP) integrated into wearables that enables on-the-go wireless charging without energy harvesting from the user, utilizing a photovoltaic power supply, flexible molding compound, and wireless charging coil modules to provide reliable and efficient charging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional wireless charging solutions are used, then wireless charging capability is provided, but the device size increases and flexibility is reduced

Engineering Contradiction:
ImproveflexibilityVSAvoiddevice size
Core Design Contradiction:
Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The patent employs flexible thin-film semiconductor packages with foldable structures that can be integrated into wearable devices. The semiconductor components are mounted on flexible substrates and encapsulated with thin-film molding compounds, enabling the charging device to bend and conform to body contours without increasing bulk volume.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The invention transitions from rigid three-dimensional packaging to two-dimensional flexible packaging that can be folded and conformally attached to surfaces. This dimensional transformation allows the wireless charging functionality to be integrated into thin wearable form factors.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of operation

If energy harvesting from user is used, then portable wireless charging is enabled, but power yield is unpredictable and conversion efficiency is low

Engineering Contradiction:
ImproveportabilityVSAvoidpower yield consistency
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The system uses a rechargeable battery that can be charged independently through wired connections or wireless charging pads, eliminating the need for continuous energy harvesting during operation. The battery serves as an energy reservoir that provides stable power output regardless of user activity levels.

Inventive Principle:
Principle #25Self-service

3Reliability

If conventional semiconductor packages are used, then wireless charging functionality is achieved, but manufacturing cost increases and design complexity increases

Engineering Contradiction:
Improvewireless charging performanceVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The wireless charging system is divided into separate functional modules: a flexible semiconductor package containing the power management IC and coil, a rechargeable battery module, and a fabric housing. This segmentation allows each component to be manufactured independently using optimized processes and assembled through flexible bonding techniques.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses composite structures combining flexible substrates, thin-film encapsulants, and fabric materials to create a lightweight, bendable semiconductor package that maintains electrical performance while reducing material costs compared to rigid ceramic or metal packaging.

Inventive Principle:
Principle #40Composite materials

4Reliability

If rigid wireless charging devices are carried, then charging functionality is provided, but user mobility is impaired and metabolic energy cost increases

Engineering Contradiction:
Improvecharging functionalityVSAvoiddevice weight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The entire wireless charging device is constructed with flexible materials including fabric housing, flexible circuit boards, and thin-film encapsulants, reducing the overall weight and allowing the device to be worn comfortably on the body without impairing mobility.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The flexible semiconductor package can be integrated into various wearable form factors including clothing, accessories, or portable pouches, making the charging device adaptable to different user needs and activities while maintaining lightweight construction.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The FFP allows for convenient, reliable, and efficient wireless charging of electronic devices on the go, eliminating the need for carrying separate charging devices and reducing metabolic energy costs, while maintaining performance and size efficiency.

Implementation Method 1

utilizing a photovoltaic power supply

Methodology Applied
Scientific EffectPhotovoltaic effect: Photovoltaic Effect

Implementation Method 2

wireless charging coil modules to provide reliable and efficient charging

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS10014710B2Foldable fabric-based packaging solution
Publication Date: 2018.07.03 INTEL CORP
  • US10014710B2 patent drawing
  • US10014710B2 patent drawing
  • US10014710B2 patent drawing

AI summary

Methods, systems, and apparatuses for a foldable fabric-based semiconductor package (FFP) that can assist with charging a secondary cell are described. An FFP includes: a ground plane; a first component over the ground plane; a second component adjacent to the ground plane; a third component adjacent to the second component; a molding compound encapsulating the ground plane, the first component, the second component, and the third component; a first fabric layer on a top side of the molding compound; and a second fabric layer on a bottom side of the molding compound. Each of the first, second, and third components includes one or more semiconductor dies. The third component is electrically coupled to each of the first and second components. The first and second components can wireless charge the secondary cell. The third component can power the first and second components. The ground plane can protect against electromagnetic signals.