Foldable Flexible Circuit Board for Display Panel Area Reduction

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Solution Overview

Problem

Flexible Printed Circuit (FPC) boards occupy excessive space in display panels due to their size, limiting the space for other components, and stacking multiple layers increases the panel thickness, making it less suitable for thinner designs.

Innovation Solution

A flexible circuit board with a foldable portion that allows the second main body portion to overlap the first main body portion, utilizing adhesives and electromagnetic interference protection layers to reduce the overall thickness and area occupied, while maintaining a larger wiring region.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the size of the FPC board is increased to meet wiring requirements, then the wiring capacity is improved, but the occupied space increases

Engineering Contradiction:
Improvewiring capacityVSAvoidoccupied space
Core Design Contradiction:
Quantity of substanceVSArea of stationary object

Solution Approach 1:

The FPC board is folded such that the second main body portion overlaps the first main body portion, nesting parts of the circuit board within itself. This reduces the occupied space while maintaining the total wiring capacity, as the wiring region area remains substantial but the footprint is minimized through the folded configuration.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The FPC board transitions from a two-dimensional planar layout to a three-dimensional folded structure. By introducing the folding dimension, the board can maintain its wiring capacity while occupying less planar space, as the overlap creates vertical stacking rather than horizontal expansion.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Quantity of substance

If multiple FPC board layers are stacked to increase wiring density, then the wiring capacity is improved, but the panel thickness increases

Engineering Contradiction:
Improvewiring densityVSAvoidpanel thickness
Core Design Contradiction:
Quantity of substanceVSLength of stationary object

Solution Approach 1:

Instead of stacking multiple separate FPC board layers vertically (which would increase thickness), the invention folds a single FPC board so that portions of it overlap and nest within each other. This achieves increased wiring density through the folded overlap rather than through vertical stacking of separate layers.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Quantity of substance

If the FPC board size is increased to accommodate more wiring lines, then the wiring capacity is improved, but the space for other components decreases

Engineering Contradiction:
Improvewiring lines capacityVSAvoidspace for components
Core Design Contradiction:
Quantity of substanceVSArea of stationary object

Solution Approach 1:

The FPC board is folded to create an overlapping configuration where the second main body portion overlaps the first main body portion. This nesting reduces the overall footprint and occupied space, thereby freeing up more area for arranging other display panel components while maintaining the necessary wiring capacity through the folded structure.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The folded design reduces the occupied area and thickness of the FPC board, allowing for a larger peripheral space in display panels without increasing the panel's thickness, thus accommodating other components and maintaining efficient wiring.

Implementation Method 1

a first adhesive, a second adhesive, and a third adhesive... The second adhesive is on the second surface, corresponds to the first main body portion, and is in the overlapping region

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS11877384B2Flexible circuit board, manufacturing method thereof and display panel
Publication Date: 2024.01.16 CHENGDU BOE OPTOELECTRONICS TECH CO LTD
  • US11877384B2 patent drawing
  • US11877384B2 patent drawing
  • US11877384B2 patent drawing

AI summary

The present disclosure provides a flexible circuit board and a display panel. The flexible circuit board is in a non-display region of a display panel and provided with a driving circuit for driving the display panel thereon. The flexible circuit board includes a first main body portion, a second main body portion, and a foldable portion, and the foldable portion is between the first main body portion and the second main body portion. The foldable portion is capable of being bent to fold the second main body portion such that the second main body portion overlaps the first main body portion.