Foldable Glass Window Etching and Polishing for Impact Resistance
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Solution Overview
Problem
Existing methods for manufacturing foldable electronic device windows, particularly those using ultra-thin glass, face challenges in achieving both impact resistance and maintaining a defect-free outer appearance.
Innovation Solution
A method involving etching and polishing a glass substrate with specific etchants and tools to create a structured surface with recesses and sloped parts, enhancing the glass's strength and appearance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If ultra-thin glass is used for foldable electronic device windows, then the device achieves foldable characteristics and reduced thickness, but the impact resistance and outer appearance quality deteriorate
Solution Approach 1:
The patent applies local quality by creating a recessed structure specifically in the folding region of the glass substrate, while maintaining the original thickness in non-folding regions. This localized modification allows the thin glass to achieve better impact resistance at the critical folding area without increasing the overall thickness of the device window.
Solution Approach 2:
The patent employs curvature by forming a recessed shape with rounded bottom and sloped sides in the folding region, rather than sharp corners. This curved geometry distributes stress more effectively during folding operations, improving impact resistance while maintaining the ultra-thin profile of the glass substrate.
2Volume of moving object
If ultra-thin glass is used for foldable electronic device windows, then the device achieves foldable characteristics and reduced thickness, but the outer appearance quality deteriorates with defects
Solution Approach 1:
The patent applies local quality by creating a recessed structure specifically in the folding region of the glass substrate, while maintaining the original thickness in non-folding regions. This localized modification allows the thin glass to achieve better impact resistance at the critical folding area without increasing the overall thickness of the device window.
Solution Approach 2:
The patent employs preliminary action by pre-forming the recessed structure in the glass substrate before final assembly. This advance preparation ensures that the folding region is already optimized for stress distribution and appearance quality, preventing defects from developing during subsequent handling and assembly processes.
3Strength
If etching and polishing processes are applied to improve impact resistance, then the strength improves, but the manufacturing complexity increases
Solution Approach 1:
The patent merges the etching and polishing processes into a single integrated manufacturing step. By combining these two operations, the patent achieves the desired recessed structure with improved impact resistance while reducing the number of separate process steps, tools, and handling operations required, thereby lowering manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves the impact resistance and reduces defects in the outer appearance of foldable electronic device windows, ensuring smoother surfaces and reduced damage risk.
Implementation Method 1
etching the glass substrate by supplying first etchant to the glass substrate exposed through the opening pattern
Implementation Method 2
polishing at least a portion of the glass substrate by supplying second etchant to a top surface of the glass substrate
Data Source
AI summary
A method for manufacturing a window includes providing a glass substrate including a first non-folding region, a second non-folding region, and a folding region interposed between the first non-folding region and the second non-folding region, forming a photoresist layer on the glass substrate, forming an opening pattern in the photoresist layer, wherein the opening pattern overlaps with the folding region and exposes the glass substrate, etching the glass substrate by supplying a first etchant to the glass substrate exposed through the opening pattern, removing the photoresist layer having the opening pattern, and polishing at least a portion of the glass substrate by supplying a second etchant to a top surface of the glass substrate.