Foldable Heat Conduction Sheet Structure for Thermal Dissipation
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Solution Overview
Problem
Conventional heat transfer devices for electronic devices face a trade-off between thermal conductivity and bendability, with thicker sheets providing better heat conduction but being difficult to bend, and thinner sheets being easy to bend but offering poor thermal conductivity, making them unsuitable for small, foldable electronic devices.
Innovation Solution
A heat transfer device comprising two heat conduction sheets with rigid and bendable parts, where the bendable parts include nonlinear sections to compensate for arc length differences, allowing for effective thermal conductivity and easy bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thicker metal sheet is used for heat conduction, then thermal conductivity is improved, but bendability deteriorates
Solution Approach 1:
The heat conduction sheet is divided into multiple thin layers (first heat conduction sheet and second heat conduction sheet) instead of using a single thick sheet. Each layer has a thickness of 0.05-0.5mm, which maintains good thermal conductivity while enabling flexibility and bendability for foldable electronic devices.
Solution Approach 2:
The invention uses a composite structure consisting of multiple heat conduction sheets with different configurations. The first heat conduction sheet has a bendable part with nonlinear section, while the second heat conduction sheet has a substantially planar surface, creating a composite system that achieves both thermal performance and flexibility.
2Ease of operation
If a thinner metal sheet is used for bending, then bendability is improved, but thermal conductivity deteriorates
Solution Approach 1:
Instead of using a single thin sheet that compromises thermal conductivity, the invention segments the heat conduction function across multiple thin layers. The stacked configuration of first and second heat conduction sheets collectively provides sufficient thermal conductivity while each individual layer remains thin enough to enable bending.
Solution Approach 2:
The invention transitions from a single-layer planar structure to a multi-layer stacked structure. By adding the vertical dimension with multiple layers, the system achieves enhanced thermal conductivity through the stack while maintaining the flexibility of individual thin layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves both good thermal conductivity and ease of bending, enabling efficient heat dissipation in foldable electronic devices by using stacked and fixedly connected heat conduction sheets with nonlinear bendable portions.
Implementation Method 1
a first heat conduction sheet including two first rigid parts and a first bendable part... a second heat conduction sheet including two second rigid parts and a second bendable part... the two first rigid parts of the first heat conduction sheet are thermally coupled to the two second rigid parts of the second heat conduction sheet
Data Source
AI summary
A heat transfer device is provided. The heat transfer device includes a first heat conduction sheet and a second heat conduction sheet. The first heat conduction sheet includes two first rigid parts and a first bendable part connected between the two first rigid parts. The second heat conduction sheet includes two second rigid parts and a second bendable part connected between the two second rigid parts. The two first rigid parts are thermally coupled to the two second rigid parts, respectively. The first bendable portion includes a nonlinear section.