Foldable Device Hinge Heat Diffusion for Display Deformation
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Solution Overview
Problem
Foldable electronic devices face challenges with heat dissipation and sudden temperature changes, which can lead to operational deterioration and deformation of flexible displays, particularly due to the high integration and miniaturization of semiconductor devices.
Innovation Solution
A heat dissipation structure is integrated into the hinge housing of a foldable electronic device, utilizing a heat diffusion member, such as a heat pipe, to manage heat and control temperature changes, thereby preventing deformation and improving space utilization without the need for a separate temperature control structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor devices are highly integrated and miniaturized to improve device performance, then productivity and performance are improved, but heat dissipation becomes more difficult and reliability deteriorates due to overheating
Solution Approach 1:
The patent combines the hinge housing structure with heat dissipation functionality by integrating a heat diffusion member into the hinge housing. This merging allows the hinge housing to serve dual purposes: mechanical support for folding/unfolding and thermal management for heat dissipation, thereby improving reliability without sacrificing performance
Solution Approach 2:
The hinge housing is designed with multi-functionality, serving both as a mechanical component for folding/unfolding the flexible display and as a thermal management component through the integrated heat diffusion member. This universal design improves heat dissipation capability while maintaining the original mechanical function
2Reliability
If a separate temperature control structure is added to manage heat, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent merges the temperature control function with the existing hinge housing structure by integrating a heat diffusion member into it. This combination eliminates the need for separate temperature control structures, thereby improving reliability while avoiding increased device complexity
Solution Approach 2:
The hinge housing is designed to perform multiple functions simultaneously: mechanical support for folding/unfolding and thermal management through the integrated heat diffusion member. This multi-functionality approach improves temperature control reliability without adding structural complexity
3Ease of operation
If the flexible display is folded and unfolded repeatedly, then portability is improved, but stress concentration occurs at the folding portion leading to deformation and reliability deterioration
Solution Approach 1:
The patent introduces a heat diffusion member as an intermediary component between the flexible display and the hinge housing. This intermediary serves multiple functions: it provides thermal management and also acts as a buffer to reduce stress concentration at the folding portion, thereby preventing deformation and maintaining display integrity during repeated folding/unfolding operations
Solution Approach 2:
The heat diffusion member is positioned in advance at the folding portion to provide cushioning and stress distribution before stress concentration can occur. This beforehand cushioning prevents buckling deformation, cracking, and peeling by distributing the stress evenly across the folding area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat dissipation structure effectively manages heat and reduces the risk of deformation in flexible displays during folding and unfolding, enhancing the reliability and portability of foldable electronic devices by maintaining performance and preventing issues like buckling or cracking.
Implementation Method 1
A heat dissipation structure is integrated into the hinge housing of a foldable electronic device, utilizing a heat diffusion member, such as a heat pipe, to manage heat and control temperature changes
Implementation Method 2
The heat diffusion member is capable of transferring heat quickly since the working fluid, which is introduced into a vacuum-sealed tube, absorbs heat from a high-temperature portion, vaporizes, moves to a low-temperature portion, condenses, and dissipates heat
Data Source
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AI summary
A foldable electronic device is provided, which includes a flexible display; a hinge assembly configured to fold and unfold a first area and a second area of the flexible display onto and away from each other; and a heat diffusion member. The hinge assembly includes a first hinge frame attached to a bottom face of the first area via a first adhesive member; a second hinge frame attached to a bottom face of the second area via a second adhesive member; a hinge pivotally connecting the first hinge frame and the second hinge frame to each other; and a hinge housing including a space, which accommodates the hinge, and connecting the first hinge frame and the second hinge frame to each other. At least a partial area of the heat diffusion member may be disposed between the flexible display and the hinge housing, in the space or at a position communicating with the space.