Foldable Hinge Heat-Dissipating Structure for Internal Heat Buildup

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Solution Overview

Problem

Heat generated from heating elements in foldable electronic devices is not effectively dissipated to the outside, leading to potential overheating and operational instability.

Innovation Solution

A heat dissipating structure is implemented in the foldable electronic device, comprising a first and second housing, a hinge assembly, and heat dissipating structures between the components to create a heat transfer path that transfers heat generated from the heating elements to the outside.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If heating elements are mounted on PCB in foldable electronic device, then functional components are integrated, but heat accumulates inside housing causing overheating

Engineering Contradiction:

Improvefunctional integrationVSAvoidheat accumulation

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

A heat transfer member is introduced as an intermediary substance between the heating elements and the housing to facilitate heat transfer. The heat transfer member includes a first portion contacting the heating elements and a second portion contacting the housing, creating a thermal bridge that efficiently conducts heat away from the components.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The heat transfer path is extended into the third dimension by routing heat from the heating elements through the heat transfer member to the housing, and then through heat radiation windows to the external environment. This multi-dimensional heat dissipation path effectively manages thermal accumulation.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If housing structure is sealed for protection, then component protection is improved, but heat dissipation is blocked

Engineering Contradiction:

Improvecomponent protectionVSAvoidheat dissipation

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The housing incorporates heat radiation windows that allow thermal energy to pass through while maintaining the structural integrity and protective function of the housing. These windows are positioned to enable heat escape without compromising the sealed protection of internal components.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The housing acts as a mediator that both protects components and facilitates heat dissipation. By incorporating heat radiation windows and thermal bridges, the housing simultaneously provides mechanical protection and thermal management functions.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Length of moving object

If device is made thinner for portability, then portability is improved, but heat dissipation space is reduced

Engineering Contradiction:

Improvedevice thicknessVSAvoidheat dissipation capability

Core Design Contradiction:

Length of moving objectVSTemperature

Solution Approach 1:

Heat dissipation is achieved by utilizing the housing exterior surface as a radiation interface. The heat transfer path extends from the internal heating elements through the heat transfer member to the housing, and then radiates heat to the external environment, effectively using external space for thermal management without increasing device thickness.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Traditional convection-based heat dissipation mechanisms are replaced with thermal conduction through the heat transfer member and heat radiation through the housing windows. This substitution allows efficient heat dissipation in a thinner device profile without requiring large internal air spaces.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively dissipates heat from the device, ensuring operational stability and preventing user burns, while maintaining portability and usability.

Implementation Method 1

a heat transfer member extending from the first plate to the housing, thermally coupled to each of the first plate and the housing

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20260032868A1Foldable electronic device comprising heat-dissipating structure

Publication Date: 2026.01.29 SAMSUNG ELECTRONICS CO LTD

AI summary

A heat dissipating structure of a foldable electronic device is provided. The electronic device includes a first housing including a first component, a second housing including a second component, a hinge assembly rotatably coupling the first and second housings, a hinge housing accommodating the hinge assembly and disposed between the first and second housings, a flexible display disposed from one region of the first housing to a region of the second housing across the hinge assembly, and foldable depending on a rotation of the hinge assembly, a first plate disposed between the flexible display and the first housing, a second plate disposed between the flexible display and the second housing, and a first heat dissipating structure disposed between the first component and thermally coupled to one end of the hinge housing, and providing a first heat transfer path for transferring heat generated from the first component to the hinge housing.