Foldable Hinge TEC Cooling for Application Processor Heat
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Solution Overview
Problem
Electronic devices such as smartphones and tablets generate excessive heat, particularly around application processors, leading to potential user burns and internal component malfunctions due to concentrated heat dissipation in hinge structures of foldable devices.
Innovation Solution
Incorporation of a thermoelectric cooler (TEC) system with a cold side attached to a heat-generating component and a hot side connected to a heat sink, controlled by processors to manage temperature and dissipate heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If materials with high thermal conductivity are used to spread heat, then heat spreading capability is improved, but there is a limit to heat spreading due to thermal conductivity limitations
Solution Approach 1:
The patent introduces phase change material as an intermediary substance between the thermoelectric cooler's cold side and the application processor. This material absorbs and distributes heat through phase transition, effectively bridging the thermal conductivity gap and enhancing heat spreading capability without relying solely on high-conductivity solid materials.
Solution Approach 2:
The patent utilizes phase change material that transitions between solid and liquid states to absorb and distribute heat. This phase transition mechanism provides superior heat spreading capability compared to conventional high-conductivity materials, as the phase change process absorbs large amounts of heat energy and distributes it across the contact area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The TEC system efficiently transfers heat away from critical components, reducing surface temperatures and preventing damage, while maintaining optimal operating conditions.
Implementation Method 1
When direct current (DC) power is applied to both ends of a thermoelectric cooler, with '+' applied to the 'N' type semiconductor and '−' applied to the 'P' type semiconductor, electrons may flow from the 'P' type semiconductor to the cold junction and then to the 'N' type semiconductor through a conductor. In this process, heat may be transferred to the 'N' type semiconductor by the Peltier effect.
Implementation Method 2
When current flows through the thermoelectric cooler by a DC power supply, heat moves from a cold side (or heat-absorbing portion) of the thermoelectric cooler to a hot side (or heat-generating portion) according to the Peltier effect.
Data Source
AI summary
An electronic device including: a first housing; a second housing; a hinge connecting the first housing and the second housing; an electrical element inside the first housing; a first plate inside the first housing and contacting a surface of the electrical element; at least one thermoelectric cooler inside the second housing and including a cold side contacting the first plate; a second plate inside the second housing and contacting a hot side of the at least one thermoelectric cooler; a memory storing one or more instructions; and one or more processors configured to execute the one or more instructions to: measure a temperature at a specified point of the electrical element or at one or more locations of the first housing where the electrical element is located; and drive the at least one thermoelectric cooler based on the temperature to move heat from the electrical element to the second plate.