Foldable Housing Bracket Materials for Heat Dissipation and Lower Weight

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Solution Overview

Problem

Electronic devices with flexible displays require different structural considerations for thermal conductivity and specific gravity of metal materials in housing structures due to varying components such as heating elements and sub-displays.

Innovation Solution

The electronic device incorporates a hinge structure with side wall structures and brackets made of different metal materials, where the side wall structures include a high thermal conductivity material for heat management and the brackets have a low specific gravity to reduce weight.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the same metal material is used for all housing structures, then manufacturing simplicity is maintained, but thermal management performance deteriorates due to insufficient heat dissipation in regions with heating elements

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidhousing structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The housing structure uses different metal materials in different regions: a first metal material with high thermal conductivity is used in the first housing region containing heating elements for effective heat dissipation, while a second metal material is used in the second housing region without heating elements. This local differentiation optimizes thermal management where needed without unnecessarily complicating the entire housing structure.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The housing structure is divided into multiple segments (first housing structure and second housing structure) with different material compositions. The first housing structure contains a bracket made of first metal material for thermal management, while the second housing structure uses second metal material, allowing each segment to be optimized for its specific functional requirements.

Inventive Principle:
Principle #1Segmentation

2Temperature

If high thermal conductivity metal material is used in all housing structures, then heat dissipation performance is improved, but device weight increases due to the material's higher density

Engineering Contradiction:
Improvethermal conductivityVSAvoiddevice weight
Core Design Contradiction:
TemperatureVSWeight of moving object

Solution Approach 1:

The first metal material with high thermal conductivity is applied locally only in the first housing structure where heating elements are present and heat dissipation is critical. The second housing structure uses a different metal material that may have lower density, thereby reducing overall device weight while maintaining thermal management performance where it is most needed.

Inventive Principle:
Principle #3Local quality

3Weight of moving object

If lightweight metal material is used for all housing structures, then device weight is reduced, but thermal management performance deteriorates due to insufficient heat dissipation capability

Engineering Contradiction:
Improvedevice weightVSAvoidheat dissipation capability
Core Design Contradiction:
Weight of moving objectVSTemperature

Solution Approach 1:

The housing structure is designed with spatially varying material properties: regions requiring heat dissipation (first housing structure with heating elements) use metal materials with high thermal conductivity, while regions without heat generation concerns (second housing structure) use lighter metal materials. This ensures thermal management performance is optimized only where necessary, minimizing overall device weight.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively transfers heat generated by components and reduces the device's weight by utilizing materials with appropriate thermal conductivity and specific gravity properties.

Implementation Method 1

the thermal conductivity of a metal material constituting a bracket that supports the printed circuit board may be important

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the specific gravity of a metal material constituting a bracket that supports the sub-display may be important

Methodology Applied
Scientific EffectSpecific gravity:

Data Source

PatentUS12416949B2Electronic device including bracket formed of metal material
Publication Date: 2025.09.16 SAMSUNG ELECTRONICS CO LTD
  • US12416949B2 patent drawing
  • US12416949B2 patent drawing
  • US12416949B2 patent drawing

AI summary

An electronic device is provided. The electronic device includes a foldable housing including a hinge structure, a first housing connected to the hinge structure and including a first side wall structure and a first bracket located inside the first side wall structure, and a second housing connected to the hinge structure and including a second side wall structure and a second bracket located inside the second side wall structure, the second housing being folded with the first housing about the hinge structure, a display panel extending from the first housing to the second housing across the hinge structure and configured to output a screen, and a second antenna structure including a second ground and a second feeding portion disposed on the second side wall structure of the second housing, wherein the first side wall structure of the first housing and the second side wall structure of the second housing may include a first metal material, and the first bracket of the first housing includes the first metal material, and the second bracket of the second housing may include a second metal material.