Foldable Device Housing Buffer Stress Dispersion
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Solution Overview
Problem
Foldable electronic devices experience stress concentration and potential breakage of the display apparatus due to the formation of a step with varying height at the recessed area, which becomes more pronounced as devices trend towards thinner volumes, leading to increased occurrences of breakage and bright spots.
Innovation Solution
A housing design featuring a buffer on the second housing body that overlaps with the fringe of the accommodating recess in the closed position, dispersing stress and reducing pressure concentration on the display module by having a lower hardness than the first housing body, thereby mitigating breakage and bright spots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the first housing body is provided with a recessed area for accommodating the input device, then the input device can be received, but a step with varying height is formed on the surface facing the second housing body, causing stress concentration when the device is closed
Solution Approach 1:
The patent applies local quality by providing a reinforcing structure specifically at the fringe area of the first housing body where stress concentration occurs. This localized reinforcement does not affect the overall recessed area functionality but specifically addresses the weak point at the fringe, allowing the housing to maintain both its input device accommodation capability and improved stress resistance at the critical location.
2Volume of moving object
If the electronic device is designed with thinner volume, then the device becomes more compact, but the display apparatus thickness decreases making it more susceptible to breakage from stress concentration
Solution Approach 1:
The patent applies beforehand cushioning by incorporating a buffer between the display apparatus and the first housing body. This buffer is positioned in advance to absorb and distribute external forces before they can concentrate on the thin display apparatus. The buffer material and structure are designed to provide cushioning protection while maintaining the thin overall device profile, thus preventing breakage without compromising compactness.
3Strength
If the buffer is disposed on the second housing body overlapping with the fringe of the accommodating recess, then stress concentration is reduced, but the device structure becomes more complex
Solution Approach 1:
The patent applies merging by integrating the buffer into the existing housing structure rather than adding it as a separate, independent component. The buffer is positioned within the housing assembly, utilizing the existing spatial relationship between the first and second housing bodies and the accommodating recess. This integration approach provides stress distribution functionality while minimizing additional structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer effectively reduces stress concentration and occurrence of breakage and bright spots in foldable electronic devices by dispersing external forces, ensuring the durability and reliability of the device even in thinner designs.
Implementation Method 1
the buffer effectively reduces stress concentration and occurrence of breakage and bright spots in foldable electronic devices by dispersing external forces
Data Source
AI summary
A housing of an electronic device includes a first housing body, a second housing body and a buffer. The first housing body defines an accommodating recess. The second housing body is assembled to the first housing body and adapted to be foldable relative to the first housing body. The buffer is disposed on the second housing body. In a closed position, the second housing body and the first housing body are stacked with each other, the accommodating recess is recessed away from the second housing body, the buffer faces the first housing body, and the buffer substantially overlaps with a fringe of the accommodating recess.