Foldable Housing Overmolded Frame Locking Against Shaft Separation

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Solution Overview

Problem

The connection between metal and plastic parts in the frame of foldable electronic devices is unstable, leading to separation issues in the shaft region, which affects the durability and stability of the device.

Innovation Solution

A housing design featuring a frame body with first and second mounting frames, including convex ribs and grooves, and an overmolded part with protrusions and engagement parts, which are engaged to enhance stability and prevent separation by limiting forces applied perpendicular and parallel to the sidewall.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Weight of moving object

If a plastic middle frame is used to reduce weight and prevent corrosion, then the electronic device becomes lighter and more corrosion-resistant, but the connection between metal and plastic parts becomes unstable and separation is prone to occur

Engineering Contradiction:
Improveweight of electronic deviceVSAvoidconnection stability
Core Design Contradiction:
Weight of moving objectVSReliability

Solution Approach 1:

The connection structure is segmented into multiple independent retention mechanisms: retention grooves on the sidewall, convex ribs with limiting grooves, and engagement parts on the overmolded portion. Each segment handles specific directional forces, collectively preventing separation while maintaining lightweight construction.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The overmolded portion is nested onto the middle frame, with engagement parts inserted into retention grooves and limited by convex ribs. This nested configuration creates a multi-level connection system where the plastic overmolded portion integrates with the metal frame through interlocking geometric features.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Ease of manufacture

If conventional connection methods are used between metal and plastic parts, then manufacturing is simpler, but separation is prone to occur in the shaft region

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidconnection stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

Retention grooves, convex ribs with limiting grooves, and engagement parts are pre-formed as integral features during the molding and manufacturing processes. These preliminary structural preparations enable stable connection without requiring additional assembly steps or complex fastening operations.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The connection structure combines metal middle frame components with plastic overmolded portions, utilizing composite material properties. The metal frame provides structural strength while the plastic overmolded portion provides corrosion resistance and integrated retention features, achieving both manufacturing simplicity and connection stability.

Inventive Principle:
Principle #40Composite materials

3Weight of moving object

If the overmolded part is made lightweight, then the electronic device achieves lightweight design, but the connection strength between the overmolded part and frame body may be reduced

Engineering Contradiction:
Improveweight of middle frameVSAvoidconnection strength
Core Design Contradiction:
Weight of moving objectVSStrength

Solution Approach 1:

The overmolded portion concentrates material and structural complexity locally at the connection regions where retention grooves, convex ribs, and engagement parts are positioned. The bulk of the overmolded portion can remain lightweight while these localized features provide enhanced connection strength through multi-directional retention mechanisms.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20260099176A1Housing and electronic device
Publication Date: 2026.04.09 HONOR DEVICE CO LTD
  • US20260099176A1 patent drawing
  • US20260099176A1 patent drawing
  • US20260099176A1 patent drawing

AI summary

This application provides a housing and an electronic device. The housing includes a frame body and an overmolded part. A first mounting frame of the frame body is provided with a first mounting groove, and a first sidewall of the first mounting groove is provided with a retention groove. A first convex rib of the first mounting frame is fixedly connected to the first sidewall, a side surface of the first convex rib is recessed inwardly toward the first convex rib, and a first limiting groove is formed between the side surface of the first convex rib and the first sidewall. A second mounting frame of the overmolded part includes a second sidewall, the second sidewall is provided with a first groove, and a sidewall of the first groove is provided with a first engagement part.