Foldable Housing with Hinged Leadframe for Component Density
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Solution Overview
Problem
Existing electronic assemblies face challenges in maximizing component density due to encapsulation methods that hinder component replacement and adjustment, and fail to effectively utilize space, especially in harsh environments.
Innovation Solution
A housing design with a leadframe and conductor tracks that allows for encapsulation of electronic components while enabling easy replacement and adjustment, incorporating secondary components like antennas and displays for enhanced functionality and space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If electronic components are encapsulated with duroplastics or protective caps, then protection against environmental influences is improved, but ease of repair and component replacement deteriorates
Solution Approach 1:
The housing is divided into a base part and a cover part that can be separated from each other. The base part remains attached to the carrier while the cover part can be removed to access the electronic component for replacement or repair, while still providing environmental protection when closed.
Solution Approach 2:
The housing transitions from a static sealed enclosure to a dynamic structure where the cover part can be opened and closed. This allows the housing to provide protection during operation but enable access when needed for maintenance or repair.
2Quantity of substance
If electronic components are mounted as bare chips, then component density is improved, but protection against environmental influences deteriorates
Solution Approach 1:
The bare chip is nested within the housing structure that folds around it. The leadframe serves as an intermediate structure that both protects the bare chip and maintains the space efficiency needed for high component density on the carrier.
Solution Approach 2:
The housing utilizes a flexible leadframe structure that can be folded to create a protective enclosure around the bare chip. This flexible approach provides protection while minimizing the space required compared to rigid housings.
3Object-affected harmful factors
If a housing is designed to fully encapsulate electronic components, then protection is improved, but space utilization deteriorates
Solution Approach 1:
The housing is segmented into functional portions: the base part integrated with the carrier and the removable cover part. This segmentation allows protection to be provided only where needed while minimizing the overall space footprint on the carrier.
Solution Approach 2:
The housing utilizes the third dimension by folding the cover part over the electronic component vertically, rather than extending protection horizontally. This vertical enclosure provides full protection while maintaining compact horizontal dimensions for high carrier density.
Data Source
Figure 1a~1b
Figure 2a~2b
Figure 3a~3c
AI summary
The invention relates to a housing for accommodating an electronic component (B) of an electronic assembly (100, 100a-100e), wherein the housing (1) has a base (10) and a cover (20), wherein the base (10) and the cover (20) are connected to one another by a hinge element (30) and the base (10) and the cover (20) of the housing (1) can be folded together by means of the hinge element (30). According to the invention, it is provided that at least one leadframe (4) having conductor tracks (5; 5a; 5b; 5c) is arranged in the housing (1), wherein at least one conductor track (5) of the leadframe (4) is arranged in the base (10) of the housing (1) and at least one further conductor track (5a; 5b; 5c) is arranged in the cover (20) of the housing (1), and wherein the at least one further conductor track (5a; 5b; 5c) extends starting from the base (10) of the housing (1), via the hinge element (30), to the cover (20) of the housing (1).