Foldable Lead Frame Stacking for Embedded Discrete Capacitors
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Solution Overview
Problem
Existing processes for stacking discrete capacitors and other components are not readily scalable, limiting manufacturing throughput and cost effectiveness.
Innovation Solution
A method involving a lead frame with strips and rails to support discrete components, followed by folding and encapsulation, allowing for efficient stacking and integration into semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If existing processes for stacking discrete capacitors are used, then the footprint on PCB is reduced, but manufacturing throughput is limited and scalability is poor
Solution Approach 1:
The lead frame is divided into multiple strips arranged end-to-end, with each strip capable of holding discrete components. This segmentation allows parallel processing of multiple components simultaneously, improving manufacturing throughput while maintaining compact footprint.
Solution Approach 2:
The invention transitions from planar arrangement of components to three-dimensional stacking by folding the lead frame. Multiple strips are folded to create vertical stacking of discrete capacitors, reducing PCB footprint while enabling scalable manufacturing through the folding process.
2Reliability
If discrete components are stacked to increase capacitance density, then ESR is reduced, but manufacturing complexity increases
Solution Approach 1:
Discrete components are placed on the lead frame strips in a preliminary flat configuration before folding. This preliminary arrangement simplifies the placement process compared to direct 3D stacking, as components are positioned on a two-dimensional surface that can be easily manipulated and folded later.
Solution Approach 2:
The lead frame acts as an intermediary structure that facilitates the stacking process. It provides a mechanical framework that holds components in the correct relative positions during assembly, then enables folding to achieve the final stacked configuration, thereby reducing the complexity of direct component-to-component assembly.
3Quantity of substance
If multiple discrete components are stacked, then capacitance near integrated circuit is increased, but manufacturing scalability is reduced
Solution Approach 1:
The lead frame structure with multiple strips is designed to be universal and scalable. The same basic structure can accommodate different numbers of discrete components by simply adding or removing strips, allowing the manufacturing process to scale from small to large quantities using the same fundamental approach.
Data Source
AI summary
A method of stacking discrete components to be embedded in a semiconductor device comprises providing a lead frame defining a plurality of strips arranged end-to-end lengthwise with a gap between each pair of adjacent strips, a rail extending parallel to the strips, and a plurality of segments respectively connecting the strips to the rail, placing a plurality of discrete components on the lead frame, each of the discrete components having electrically isolated first and second terminals and being placed so as to bridge the gap between a pair of adjacent strips with the first and second terminals of the discrete component being respectively on one of the pair of adjacent strips and the other of the pair of adjacent strips, removing the rail from the lead frame, and folding the lead frame between the discrete components so as to bring the discrete components into a stacked configuration.