Foldable Semiconductor Module Housing for Base-Plate-Free Sealing
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Solution Overview
Problem
Existing semiconductor module housings struggle to form a satisfactory seal without a base plate, requiring complex mechanical connections and high production costs.
Innovation Solution
A housing design featuring foldable side elements and hinge portions that form a closed frame around the substrate, exerting pressure and optionally using a sealing element to ensure a secure seal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a base plate is used with mechanical connection elements (screws or rivets) to seal the housing, then the sealing reliability is improved, but the device complexity and production cost increase
Solution Approach 1:
The invention removes the base plate from the semiconductor module structure, eliminating the need for mechanical connection elements like screws or rivets. The housing is designed to be foldable and can be directly attached to the substrate, extracting the base plate function while simplifying the overall structure and reducing production complexity.
Solution Approach 2:
The housing is designed with foldable side elements that can be bent during assembly to wrap around the substrate. This dynamic folding mechanism allows the housing to adapt to the substrate shape and form a secure seal without requiring additional mechanical fasteners, thereby maintaining sealing reliability while reducing structural complexity.
2Reliability
If a base plate is used with mechanical connection elements to seal the housing, then the sealing reliability is improved, but the production time and cost increase
Solution Approach 1:
By removing the base plate and mechanical connection elements, the assembly process is significantly simplified. The foldable housing can be directly attached to the substrate in fewer steps, reducing production time while maintaining adequate sealing through the folding mechanism and adhesive bonding.
Solution Approach 2:
The housing is pre-designed with foldable side elements and attachment features that enable direct mounting to the substrate. This preliminary design preparation allows for rapid assembly without requiring additional mechanical fastening steps, thereby reducing production time while ensuring reliable sealing.
3Device complexity
If a foldable housing design is used without a base plate, then the device complexity is reduced, but the sealing reliability may deteriorate
Solution Approach 1:
The foldable side elements are designed to be bent during assembly to wrap tightly around the substrate, creating a conformal seal. This dynamic folding action allows the housing to adapt to the substrate shape and maintain reliable sealing without requiring a base plate or mechanical fasteners.
Solution Approach 2:
The attachment mechanism uses adhesive bonding with controlled curing parameters to secure the foldable housing to the substrate. By optimizing the adhesive properties and curing conditions, reliable sealing is achieved through chemical bonding rather than mechanical fastening, maintaining sealing integrity while reducing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design provides a reliable seal without a base plate, simplifying assembly, reducing costs, and ensuring effective containment of encapsulants, while allowing for efficient manufacturing through multi-cavity injection molding.
Implementation Method 1
folding a housing around a substrate by bending the plurality of side elements about respective bending axes
Data Source
AI summary
A housing for a semiconductor module comprises a first plurality n of side elements, and a second plurality m of hinge portions, wherein n=m+1, in an unassembled state of the housing, the side elements are arranged successively in one row and each of the hinge portions is arranged to connect two directly neighboring side elements, each of the side elements is foldable with respect to at least one other side element about a respective folding axis, and the side elements are configured to form a closed frame in an assembled state of the housing.