Foldable OHT Support Structure for Semiconductor Fab Interference
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Solution Overview
Problem
Conventional side track buffers in semiconductor manufacturing facilities interfere with operations during installation or replacement, causing losses and posing challenges in fire suppression due to obstructed water streams, and require redesign to minimize interference and exposure.
Innovation Solution
An article transfer apparatus with a top support unit, a bottom support unit, a foldable link unit, and a folding driving unit that allows size variation and concealed driving points, integrated with sensors and control systems for efficient container transfer and fire safety, ensuring the apparatus does not obstruct water streams during fires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the side track buffer is installed at the top of semiconductor manufacturing facilities, then container transfer function is achieved, but water stream path is blocked during fire suppression
Solution Approach 1:
The side track buffer employs a movable support structure that can dynamically adjust its position between extended and retracted states. During normal operation, the buffer extends to provide container storage. During fire suppression, the buffer retracts to allow unobstructed water stream passage, thus resolving the contradiction between maintaining fire suppression capability and preventing water stream obstruction.
Solution Approach 2:
The invention introduces spatial dimensionality by positioning the support structure in a movable manner, allowing it to transition between different spatial configurations. This enables the buffer to occupy space when needed for container transfer and clear the water stream path when needed for fire suppression, effectively managing the spatial conflict between these two functions.
2Ease of operation
If the side track buffer is mechanically driven, then driving function is achieved, but driving points are exposed to the outside
Solution Approach 1:
The driving mechanism is extracted from the external environment and integrated within the enclosed structure of the side track buffer. The driving points are taken out from exposure and positioned inside the buffer housing, eliminating the harmful effect of exposed driving points while preserving the mechanical driving function through internal mechanism design.
Solution Approach 2:
The driving mechanism is nested within the enclosed structure of the side track buffer. The drive shaft and other mechanical components are housed inside the buffer body, creating a nested configuration where the driving function is maintained but the driving points are concealed and protected from external exposure.
3Productivity
If the side track buffer is installed in the workspace, then container transfer is enabled, but interference with semiconductor facilities occurs during installation or replacement
Solution Approach 1:
The side track buffer utilizes a movable support structure that can dynamically adjust its position and configuration. During facility installation or replacement, the buffer can be moved or reconfigured to minimize interference with the workspace, thereby reducing operational losses while maintaining container transfer efficiency during normal operation.
Solution Approach 2:
The support structure is divided into movable segments or modular components that can be independently adjusted or repositioned. This segmentation allows the buffer to adapt its configuration to accommodate facility installation or replacement activities, reducing interference and operational losses while preserving container transfer functionality.
Data Source
AI summary
Embodiments of the inventive concept provide an article transfer apparatus and an article transfer method which can temporarily load a container, and which can vary its size according to necessity, so an interference with surrounding structures do not occur while varying the size. The inventive concept provides an article transfer apparatus at which an OHT transfers a container. The article transfer apparatus includes: a top support unit fixed to a top space within a semiconductor fab; a bottom support unit positioned spaced apart below the top support unit and on which the container is mounted; a link unit coupled between the top support unit and the bottom support unit and which can be folded; a folding driving unit connecting the top support unit and the link unit, and configured so when not driven a space that the container can be mounted on is formed by the link unit being spread, and when driven the bottom support unit closely contacts the top support unit by folding the link unit, and wherein the folding driving unit is positioned to not go beyond a top portion of the support unit.