Foldable OLED Display Structure With Transparent Region and Heat Dissipation
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Solution Overview
Problem
Existing illumination devices, particularly those using LEDs, face challenges in achieving flexible and efficient heat dissipation and light distribution across a broad area while maintaining structural integrity and brightness uniformity.
Innovation Solution
A flexible LED illumination device is constructed with a layered structure comprising a rigid support substrate and an elastic encapsulation layer, where LEDs are mounted to the substrate and encapsulated between the layers, allowing for efficient heat dissipation and light distribution through a combination of thermal conductivity and optical transparency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a rigid substrate is used for mounting LEDs, then thermal management and structural integrity are improved, but flexibility and bendability deteriorate
Solution Approach 1:
The device is divided into multiple functional layers: a flexible substrate layer, a rigid support substrate layer for thermal management, and an elastic encapsulation layer. This segmentation allows each layer to perform its specific function - the rigid substrate dissipates heat effectively while the flexible substrate and elastic encapsulation layer maintain overall flexibility and bendability of the device.
2Illumination intensity
If an elastic encapsulation layer is used, then light distribution and flexibility are improved, but structural stability and heat dissipation deteriorate
Solution Approach 1:
The rigid support substrate acts as an intermediary between the LEDs and the flexible substrate. It provides a stable thermal management platform that doesn't interfere with the light distribution function of the elastic encapsulation layer, while also serving as a heat dissipation pathway that protects the flexible components from excessive heat.
3Productivity
If LEDs are mounted densely to increase area utilization, then productivity and light output are improved, but heat dissipation efficiency and manufacturing precision deteriorate
Solution Approach 1:
The rigid support substrate serves multiple functions simultaneously: it provides a stable mounting platform for dense LED arrays, acts as a heat dissipation structure, and maintains structural integrity during manufacturing and operation. This multi-functionality enables high-density LED mounting without compromising manufacturing precision or heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a flexible and durable LED illumination device that maintains brightness uniformity and efficiently dissipates heat, even when bent or folded, by utilizing a rigid substrate for thermal management and an elastic encapsulation layer for light distribution.
Implementation Method 1
The first flexible sheet is defined by a first broad-area surface and an opposing second broad-area surface that is parallel to the first broad-area surface. The second flexible sheet is optically transmissive and is defined by a third broad-area surface and an opposing fourth broad-area surface that is generally parallel to the third broad-area surface. The flexible LED illumination device further includes a plurality of LEDs mounted to the first flexible sheet and encapsulated between the first and second flexible sheets.
Implementation Method 2
The second flexible sheet is optically transmissive and is defined by a third broad-area surface and an opposing fourth broad-area surface that is generally parallel to the third broad-area surface.
Data Source
AI summary
An electronic display device having a layered monolithic sheet-form structure with a rectangular shape, rounded corners, a thickness under 1.5 mm, and a smooth outer surface. The layered structure includes a first optically transparent layer with Young's modulus of at least 1 GPa, a second optically transparent or translucent layer, and a third opaque heat-conductive layer. A light emitting region contains a two-dimensional pixel array of at least one million individually addressable organic light emitting diodes (OLEDs) arranged with a density of at least 300 pixels per inch across a 10-30 centimeter dimension. Each pixel contains red, green, and blue OLEDs sized from 1 to 300 micrometers. The array covers over 90% of the device area. Adhesive layers are positioned on both sides of the array. The structure has a longitudinal fold area allowing repetitive folding with a 1-5 mm radius of curvature and at least one transparent area.