Foldable Device Composite Panel Using Cold Bending to Reduce Defects
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Solution Overview
Problem
Current electronic devices with curved surfaces face issues in manufacturing quality and efficiency due to thermal bending processes that can damage panels and cause defects like water ripples or pitting.
Innovation Solution
A foldable electronic device design involving a composite panel adhered to a back frame via a patterned adhesive element using a cold bending process, which maintains panel integrity and reduces defects by avoiding high-temperature bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If thermal bending process is used to fabricate devices with curved surfaces, then the curved surface can be formed, but the appearance quality of panels deteriorates due to defects like water ripples or pitting
Solution Approach 1:
The patent changes the temperature parameter from high-temperature thermal bending to room temperature cold bending. This parameter change eliminates the thermal damage that causes water ripples and pitting defects, while still achieving the desired curved surface shape through mechanical force at lower temperatures.
Solution Approach 2:
The patent replaces the thermal field (heat-based bending) with a mechanical field (cold bending using mechanical force). This substitution eliminates the harmful thermal effects on panel appearance while maintaining the ability to form curved surfaces through controlled mechanical deformation.
2Shape
If thermal bending process is used, then curved surfaces can be formed, but manufacturing efficiency deteriorates due to panel damage and defects
Solution Approach 1:
By changing the temperature parameter to room temperature, the patent eliminates panel damage and defects associated with thermal bending. This results in higher manufacturing efficiency as panels do not need to be discarded or reworked, directly improving productivity.
3Shape
If thermal bending process is used, then curved surfaces can be formed, but panel integrity deteriorates due to damage from high temperature
Solution Approach 1:
The patent changes the temperature parameter from high temperature to room temperature, eliminating thermal damage to panel integrity. The cold bending process maintains panel reliability while still achieving the required curved surface shape.
Solution Approach 2:
The patent replaces thermal field with mechanical field, substituting heat-based deformation with force-based deformation at room temperature. This substitution preserves panel integrity by avoiding thermal damage while achieving the desired curved shape through controlled mechanical bending.
Data Source
AI summary
A foldable electronic device is provided. The foldable electronic device includes a backboard, a supporting element disposed on the backboard, a composite panel disposed on the backboard, and an adhesive element disposed on the supporting element. The composite panel and the supporting element directly adhere to each other via the adhesive element. In a top view of the foldable electronic device, the adhesive element has first part and a second part, and the first part is separated to the second part.