Foldable PCB Assembly for Compact Surgical Instrument Drives
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Solution Overview
Problem
Robotic surgical systems lack a compact and efficient design for their instrument drive units, which complicates manufacturing, assembly, and heat dissipation, while requiring robustness and durability.
Innovation Solution
An integrated circuit configuration with multiple circuit boards and a nexus, allowing for a transition between open and three-dimensional configurations to accommodate a motor assembly, enhancing manufacturing ease and heat dissipation through ventilation holes, and providing mechanical and electrical engagement with motor components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complex instrument drive unit design is used to provide robust and durable assembly, then reliability is improved, but device complexity increases and manufacturing difficulty increases
Solution Approach 1:
The instrument drive unit is divided into modular components including a motor pack, circuit board assembly, and housing. The circuit board assembly itself is segmented into multiple layers with distinct functional zones. This segmentation allows each module to be manufactured and tested independently, then assembled together, maintaining reliability while reducing overall design complexity and facilitating manufacturing.
2Adaptability or versatility
If more internal components are integrated into the instrument drive unit, then functionality is improved, but space requirements increase and manufacturing difficulty increases
Solution Approach 1:
The circuit board assembly is nested within the motor pack housing, with the circuit board positioned inside the motor assembly cavity. The motor assembly itself is nested within the instrument drive unit housing. This nested arrangement allows multiple functional components to be integrated in a compact configuration, maximizing functionality while minimizing overall volume and simplifying manufacturing.
3Volume of moving object
If internal components are compacted to save space, then volume is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The housing and circuit board are designed with localized thermal management features including heat sinks positioned near high-power motor components, ventilation channels in the housing walls, and thermally conductive pathways in the circuit board layout. This local quality approach allows effective heat dissipation in specific hot spots while maintaining compact overall volume, as thermal management is applied only where needed rather than throughout the entire assembly.
4Temperature
If ventilation holes are added to circuit boards for heat dissipation, then temperature control is improved, but manufacturing complexity increases
Solution Approach 1:
The circuit board incorporates ventilation holes and porous structures that are integrated into the board fabrication process itself. These openings are created during standard PCB manufacturing using drilling and plugging techniques, allowing thermal ventilation without requiring complex post-processing or assembly steps. The porous design provides effective heat dissipation while maintaining compatibility with conventional manufacturing methods.
Data Source
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AI summary
An integrated circuit includes a nexus and a first, a second, a third, and a fourth circuit board. Each of the first and second circuit boards is coupled to opposing sides of the nexus, and each of the third and fourth circuit boards is coupled to opposing sides of the second circuit board. The integrated circuit is transitionable between a first, open configuration, in which the first, second, third and fourth circuit boards and the nexus are substantially coplanar, and a second configuration, in which the first, second, third and fourth circuit boards and the nexus are coupled to one another to define a cavity therein.