Foldable Planar Heat Dissipation Structure for Compact Electronics
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Solution Overview
Problem
Conventional heat dissipation structures in electronic devices face challenges in effectively distributing heat evenly, especially in compact designs, leading to temperature hotspots and reduced efficiency, while also being difficult to manufacture and store efficiently.
Innovation Solution
A foldable planar heat dissipation structure composed of a thermally conductive and electrically insulating layer combined with a metal layer, allowing for a three-dimensional configuration that can be easily stored and transported, with a thermal conductivity coefficient greater than 0.5 W/mK, and featuring a base portion and foldable flap portions for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional three-dimensional heat dissipation structure is used, then heat dissipation effectiveness is improved, but the device occupies more interior space and is difficult to store and transport
Solution Approach 1:
The heat dissipation structure transitions from a traditional three-dimensional form to a two-dimensional foldable planar configuration. When collapsed, it occupies minimal space similar to a flat sheet; when deployed, it expands into a three-dimensional shape that effectively contacts and cools electronic components, thus resolving the contradiction between space occupation and heat dissipation effectiveness
Solution Approach 2:
The heat dissipation structure is designed to be dynamically transformable between a collapsed two-dimensional state for storage/transport and an expanded three-dimensional state for operation. This dynamic capability allows the structure to adapt to different spatial requirements while maintaining its heat dissipation function
2Volume of moving object
If the size of electronic devices is reduced, then portability is improved, but the space available for heat dissipation structure is reduced
Solution Approach 1:
By utilizing the two-dimensional foldable planar configuration, the heat dissipation structure can be stored in a ultra-thin profile that occupies minimal vertical space within compact devices. When needed, it expands outward rather than requiring additional device volume, thus enabling effective heat dissipation in miniaturized devices
3Ease of operation
If a foldable planar heat dissipation structure is used, then storage and transportation ease is improved, but structural complexity increases
Solution Approach 1:
The heat dissipation structure is divided into multiple planar sections or panels that can be folded relative to each other. This segmentation enables the structure to collapse into a compact form for storage while maintaining manufacturing simplicity through modular construction
Solution Approach 2:
The structure utilizes thin, flexible planar elements that can be easily folded and collapsed without requiring complex mechanical mechanisms. These thin-film-like components maintain structural integrity while enabling simple storage and deployment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved heat distribution, reduced manufacturing costs, and easier storage and transportation due to its compact flat profile, while maintaining high manufacturing efficiency and effectively cooling electronic components within minimal spatial requirements.
Implementation Method 1
a first electrically insulating and thermally conductive layer (120) having a thermal conductivity coefficient greater than 0.5 W/mK
Implementation Method 2
a metal layer (130)... The first electrically insulating and thermally conductive layer (120) and the metal layer (130) are structurally integrated and in thermal contact
Data Source
AI summary
The instant disclosure relates to a planar heat dissipation structure, which comprises a first electrically insulating and thermally conductive layer having a thermal conductivity coefficient greater than 0.5 W/mK and a metal layer chemically bonded to and in thermal contact with the first electrically insulating and thermally conductive layer. The planar heat dissipation structure forms a one-piece structure that is configurable from a substantially planar collapsed state to a folded three-dimensional state, and defines a base portion and at least one flap portion configured to be foldable with respect to the base portion thereon, such that the first electrically insulating and thermally conductive layer constitutes an inner surface of the planar heat dissipation structure to define a covering space. The instant disclosure also discloses an electronic device that utilizes said foldable planar heat dissipation structure.