Foldable Device Support Structure for Open-Space Cooling

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Solution Overview

Problem

Conventional foldable electronic devices face issues with poor heat dissipation and high surface temperatures due to limited internal space, leading to inefficient cooling and increased noise from heat dissipation fans.

Innovation Solution

A foldable electronic device design that includes a support portion which can switch between a folded and a supporting position, creating an open space for improved air intake and heat dissipation, thereby enhancing cooling efficiency and reducing fan noise.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the support portion is kept in the folded position to maintain a compact structure, then the device portability is improved, but the heat dissipation capability deteriorates

Engineering Contradiction:
Improvedevice compactnessVSAvoidheat dissipation capability
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The support portion is designed to be dynamically adjustable between folded and supporting positions. This dynamic configuration allows the device to switch between compact storage mode and heat dissipation mode, resolving the contradiction between maintaining small volume and achieving effective heat dissipation.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The support portion is extended outward from the rear surface of the first body, utilizing the spatial dimension behind the display. This dimensional extension provides heat dissipation space without increasing the device's footprint when folded, effectively separating the heat dissipation function from the device's main volume.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If conventional heat dissipation methods are used in limited internal space, then the system operation is maintained, but the heat dissipation efficiency deteriorates and noise increases

Engineering Contradiction:
Improvesystem operationVSAvoidheat dissipation efficiency
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The heat dissipation function is extracted from the limited internal space of the device body and relocated to the externally extended support portion. This extraction allows the cooling system to operate in a dedicated space with adequate airflow, improving heat dissipation efficiency without compromising system operation.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design improves heat dissipation capabilities and reduces noise by facilitating cold air introduction, resulting in a more efficient system operation.

Implementation Method 1

an open space is formed between the support portion and the first body, facilitating introduction of cold air into a system for heat dissipation

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS12464661B2Foldable electronic device
Publication Date: 2025.11.04 ASUSTEK COMPUTER INC
  • US12464661B2 patent drawing
  • US12464661B2 patent drawing
  • US12464661B2 patent drawing

AI summary

A foldable electronic device is provided, including a first body and a second body. The first body includes a front surface and a rear surface. The second body is arranged at the rear surface and includes a support portion. A system is arranged in the support portion. The support portion is used for being switched between a folded position and a supporting position. When the support portion is located at the folded position, the support portion abuts against the rear surface. When the support portion is located at the supporting position, an open space is formed between the support portion and the rear surface.