Foldable Test Board With Hinge Regions For Semiconductor Testing
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Solution Overview
Problem
Existing test boards for semiconductor devices lack improved test reliability, particularly in terms of electrical connectivity and signal transmission efficiency during reliability tests.
Innovation Solution
A test board design featuring a first and second region with aligned test sockets, a hinge portion for folding or unfolding, and connectors at each end for selective electrical connections, allowing for improved angular adjustment and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a rigid test board structure is used, then manufacturing precision is maintained, but adaptability to different test configurations is reduced
Solution Approach 1:
The test board is divided into multiple regions (first region, second region, third region) that can be independently positioned and connected through hinge portions, allowing each region to be optimized for specific test functions while maintaining overall adaptability
Solution Approach 2:
The test board transitions from a rigid structure to a dynamic structure with hinge portions that enable folding and unfolding movements, allowing the board to adapt to different test configurations and chamber spaces while maintaining manufacturing precision through controlled joint mechanisms
2Reliability
If test sockets are fixed in position, then manufacturing precision is ensured, but signal transmission efficiency is reduced due to fixed routing paths
Solution Approach 1:
Test sockets are positioned on flexible substrates that can be routed through the hinge portions, allowing signal paths to adapt to different board configurations while maintaining connection reliability through flexible circuit board technology
Solution Approach 2:
Connectors serve as intermediary elements between test sockets and external test equipment, providing selective electrical connections that can be configured through the hinge portion movements, thereby improving signal transmission efficiency without direct fixed routing
3Area of stationary object
If the test board is designed for compact storage, then space utilization is improved, but ease of operation for testing is reduced
Solution Approach 1:
The test board can be folded into a compact configuration for storage and transport, then unfolded to a flat configuration for testing operations, with hinge portions providing controlled movement between states to ensure ease of deployment while maximizing space utilization
Solution Approach 2:
The use of flexible printed circuit boards allows the test board to be folded and unfolded without damaging electrical connections, enabling compact storage while maintaining ease of operation during testing through flexible yet durable construction
Data Source
AI summary
A test board is provided. The test board comprises a first region which includes a first upper surface with first test sockets aligned thereon, and a first lower surface opposite to the first upper surface, a second region which includes a second upper surface with second test sockets aligned thereon, and a second lower surface opposite to the second upper surface, a hinge portion between the first region and the second region, and configured to connect the first region and the second region such that the first region and the second region are folded or unfolded, a first connector at one end of the first region opposite to the hinge portion and a second connector at one end of the second region opposite to the hinge portion.