Foldable Thermal Ground Plane With Wavy Vapor Structure
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Solution Overview
Problem
Thermal management is a significant challenge for foldable electronic devices such as smartphones and AR/VR headsets, as they require effective heat dissipation while accommodating bending or folding mechanisms.
Innovation Solution
A thermal ground plane design comprising casings with folding and non-folding regions, incorporating a vapor structure and a mesh with arteries, and a wavy out-of-plane structure to facilitate heat transfer and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a rigid thermal ground plane is used to ensure effective heat dissipation, then thermal management performance is improved, but the device cannot accommodate folding or bending mechanisms
Solution Approach 1:
The thermal ground plane is divided into multiple segments that can independently deform. The structure includes a first thermal ground plane and a second thermal ground plane separated by a gap, allowing each segment to flex and bend independently during device folding while maintaining thermal conduction paths.
Solution Approach 2:
The patent employs flexible thermal ground planes made from thin, bendable materials that can accommodate device folding. The thermal ground planes are designed as thin-film structures that maintain thermal conductivity while allowing mechanical deformation, enabling the device to fold without compromising thermal management.
2Adaptability or versatility
If the thermal ground plane is made flexible to allow folding, then adaptability is improved, but thermal contact and heat dissipation performance deteriorate
Solution Approach 1:
The thermal ground plane structure is designed to be dynamic rather than static. The flexible thermal ground planes can change their shape and configuration during device operation, adapting to folded or unfolded states while maintaining adequate thermal contact through elastic deformation and contact pressure.
3Temperature
If vapor structures are included for thermal management, then heat dissipation is improved, but the complexity of the device structure increases
Solution Approach 1:
The vapor structure is integrated directly into the thermal ground plane assembly, merging the vapor chamber function with the thermal conduction function. This consolidation reduces the number of separate components and simplifies the overall device structure while maintaining effective heat dissipation through the vapor-phase cooling mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows for efficient heat dissipation and flexibility, maintaining thermal performance even when the device is folded, reducing stress and preventing vapor flow obstruction.
Implementation Method 1
a vapor structure (125)
Implementation Method 2
a mesh (120) with arteries
Data Source
AI summary
Some embodiments include a thermal ground plane comprising a first and second casing with folding and non-folding regions. The thermal ground plane may also include a vapor structure and a mesh. The mesh may be disposed on an interior surface of the second casing and the mesh include a plurality of arteries extending substantially parallel with a length of the thermal ground plane. The folding region of the first casing may have an out-of-plane wavy structure. The valleys and peaks of the out-of-plane wavy structure, for example, may extend across a width of the first active region substantially parallel with a width of the thermal ground plane.