Foldable Thermal Ground Planes for Serviceability
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Solution Overview
Problem
Existing thermal solutions in electronic devices often compromise between thermal cooling performance and serviceability, as soldered fan covers and rigid thermal spreaders either enhance cooling capacity but hinder maintenance access or facilitate serviceability at the cost of reduced cooling efficiency.
Innovation Solution
The introduction of foldable thermal ground planes with fixed and movable heat conductors, coupled via soft hinges, allows for both effective heat dissipation and improved serviceability by enabling components like fans and memory modules to be accessed without dismantling the thermal solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If rigid thermal spreaders and soldered fan covers are used, then thermal cooling performance is improved, but serviceability deteriorates
Solution Approach 1:
The thermal ground plane is divided into multiple sections (first section, second section, third section) that can be independently accessed. The first section covers high-power components while the second and third sections can be folded away to access fans and memory modules, enabling selective access without removing the entire thermal solution.
Solution Approach 2:
The thermal ground plane incorporates movable sections that can be folded between a first position (providing thermal coverage) and a second position (providing access to components). This dynamic reconfiguration allows the same structure to serve both thermal cooling and serviceability requirements.
2Power
If fan covers are soldered to thermal modules, then thermal cooling capacity is enhanced, but maintenance access becomes more difficult
Solution Approach 1:
The fan covers are separated from the main thermal module into distinct sections that can be independently accessed. The second section can be folded away to access fans without affecting the first section's thermal coverage, enabling maintenance without compromising thermal performance.
Solution Approach 2:
The fan cover sections are designed to be movable rather than fixed, allowing them to be folded between positions that provide thermal coverage and positions that provide access for maintenance. This dynamic design eliminates the need to choose between cooling performance and maintenance accessibility.
3Reliability
If rigid thermal solutions are used, then thermal conductivity is improved, but adaptability to different configurations deteriorates
Solution Approach 1:
The thermal ground plane transitions from a rigid fixed configuration to a dynamic reconfigurable structure. Sections can be folded between different positions to adapt to various component layouts and access requirements while maintaining thermal conductivity through the movable connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves enhanced thermal cooling performance while maintaining serviceability, reducing junction temperatures by about four degrees Celsius and increasing thermal conductivity, thus addressing the limitations of conventional rigid thermal solutions.
Implementation Method 1
heat conductors, coupled via soft hinges, allows for both effective heat dissipation
Implementation Method 2
a vapor chamber and/or fan cover may need to be removed during such a service procedure
Implementation Method 3
The first movable heat conductor 115 and the second movable heat conductor 120 are rotatable or foldable about respective hinges 130, 133
Data Source
AI summary
Systems, apparatus, articles of manufacture, and methods are disclosed for foldable thermal ground planes for electronic devices. An example an apparatus to cool an electronic device includes a first plate; a second plate; a plurality of first pillars extending between the first plate and the second plate, the plurality of first pillars having a first shape; a plurality of second pillars extending between the first plate and the second plate, the plurality of second pillars having a second shape, the second shape different than the first shape; and a hinge separating the apparatus into a first section and a second section, the plurality of second pillars in the hinge.