Folded Antenna Assembly Layout for Easier Mobile Terminal Mounting

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Solution Overview

Problem

The challenge is to simplify the mounting process of antenna modules in mobile terminals while improving communication performance.

Innovation Solution

The proposed solution involves an antenna assembly with a substrate that includes a first sub-portion for the antenna units, a second sub-portion for the integrated circuit, and a bending portion connecting them. This design allows for easier integration and reduced interference between the antenna units and the integrated circuit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple antenna modules are mounted inside the mobile terminal to improve communication performance, then wireless communication performance is improved, but the mounting process becomes more complex

Engineering Contradiction:
Improvewireless communication performanceVSAvoidmounting process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple antenna units and the integrated circuit onto a single substrate, creating an integrated antenna assembly. This merging approach maintains multiple antenna functions while simplifying the mounting process, as the entire assembly is installed as one unit rather than mounting separate antenna modules individually.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The substrate is divided into a first sub-portion for accommodating antenna units and a second sub-portion for accommodating the integrated circuit, connected by a bending portion. This segmentation allows optimized layout and electrical connection while maintaining overall integration, resolving the contradiction between functional complexity and mounting simplicity.

Inventive Principle:
Principle #1Segmentation

2Volume of moving object

If antenna units and integrated circuit are placed close together to reduce space, then device compactness is improved, but position interference between antenna units and integrated circuit increases

Engineering Contradiction:
Improveassembly sizeVSAvoidposition interference
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The substrate utilizes three-dimensional space by incorporating a bending portion that connects the first sub-portion (antenna units) and second sub-portion (integrated circuit) in a non-planar configuration. This dimensional approach allows compact overall size while maintaining adequate spatial separation between antenna units and the integrated circuit to minimize interference.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The substrate employs different regional configurations: the first sub-portion is optimized for antenna unit arrangement with appropriate spacing and grounding, while the second sub-portion is optimized for integrated circuit mounting. The bending portion provides transitional geometry that maintains signal integrity and reduces interference between these functionally distinct regions.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20250062522A1Antenna assembly, housing and mobile terminal
Publication Date: 2025.02.20 YUNGU GUAN TECH CO LTD
  • US20250062522A1 patent drawing
  • US20250062522A1 patent drawing
  • US20250062522A1 patent drawing

AI summary

An antenna assembly, a housing and a mobile terminal. The mobile terminal includes an antenna assembly and a housing. The antenna assembly includes: a substrate, including a first sub-portion and a second sub-portion that are spaced apart from each other in a first direction; an antenna module, arranged in the first sub-portion and including two or more antenna units spaced apart from one another in the first sub-portion; an integrated circuit, arranged in the second sub-portion; and a plurality of connecting portions, arranged on the substrate and electrically connecting the antenna units with the integrated circuit.