Folded Cardboard Buffer Device for Electronic Packaging Stress
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Solution Overview
Problem
Conventional paper packing structures for electronic products are inadequate in buffering colliding stress and have complex assembly processes, while plastic alternatives pose environmental concerns.
Innovation Solution
A packing structure comprising buffer devices with folded baseboards, supporting boards, and cut lines/slots for enhanced stress buffering, easily assembled using cardboard materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If plastic buffer materials are used, then protective effect against colliding stress is improved, but environmental harm increases
Solution Approach 1:
The patent changes the material parameter from plastic to paper-based materials, transforming the packing structure into an environmentally friendly alternative that maintains protective functionality while reducing environmental harm
Solution Approach 2:
The patent converts the previously harmful plastic materials into beneficial recyclable paper materials, turning an environmental problem into a solution through material substitution
2Object-generated harmful factors
If paper packing structures are used, then environmental harm is reduced, but protective effect against colliding stress deteriorates
Solution Approach 1:
The patent divides the packing structure into multiple functional components including buffer members, supporting boards, and buffer breaches, where each segment contributes to stress distribution and protection, enabling paper materials to achieve adequate protective effect
Solution Approach 2:
The patent creates a composite paper-based packing structure combining multiple components (buffer members with folded baseboards, supporting boards, buffer breaches) to achieve the necessary protective effect that single-material paper structures cannot provide
3Object-generated harmful factors
If paper packing structures with many pieces of cardboards are used, then environmental harm is reduced, but assembly complexity increases
Solution Approach 1:
The patent merges multiple cardboard pieces into integrated components such as buffer members with folded baseboards and supporting boards that are pre-joined, reducing assembly complexity while maintaining the environmental benefits of paper materials
Data Source
AI summary
A buffer device comprises a buffer member, a lateral side, a first supporting board and a second supporting board. In this case, the buffer member is formed with at least one folded baseboard. The lateral side is located at one side of the buffer member and has a first edge and a second edge. One side of the first supporting board is joined to the first edge and a first portion of the first supporting board covers at least one part of the lateral side. A second portion of the first supporting board is substantially perpendicular to the first portion and is folded to insert into the lateral side. One side of the second supporting board is joined to the second edge and a third portion of the second supporting board covers at least one part of the lateral side. A fourth portion of the first supporting board is substantially perpendicular to the third portion and is folded to insert into the lateral side.


