Folded Circuit Board Polygonal Funnel Shape
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Solution Overview
Problem
Conventional circuit boards for lighting devices are limited to linear or trench-like shapes due to bent configurations, which restricts their shape versatility and increases component count, affecting manufacturing efficiency and cost.
Innovation Solution
A circuit board with a polygonal funnel shape is achieved by folding the substrate, allowing for integrated heat dissipation and reflection capabilities without material removal, reducing component count and facilitating manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the circuit board uses a bent configuration to achieve linear or trench-like shapes, then the light reflection function is improved, but the shape versatility is limited and component count increases
Solution Approach 1:
The circuit board is divided into multiple planar sections connected by folding lines, allowing each section to be independently positioned to achieve desired light reflection angles while creating diverse overall shapes beyond simple linear or trench-like configurations
Solution Approach 2:
The circuit board transitions from a two-dimensional planar structure to a three-dimensional folded structure, enabling complex spatial arrangements that provide both versatile shapes and effective light reflection surfaces without increasing component count
2Shape
If material is removed from the substrate to create the desired shape, then the shape complexity is improved, but material loss increases and manufacturing complexity increases
Solution Approach 1:
Instead of removing material to create complex shapes, the invention changes the geometric parameters of the substrate by folding it along predetermined lines, transforming a simple polygonal planar shape into a complex three-dimensional folded shape without material removal
Solution Approach 2:
The substrate itself serves dual purposes: it provides both the structural base and the folded three-dimensional shape, eliminating the need for separate components or material removal processes to achieve the desired geometry
3Adaptability or versatility
If the substrate is folded to form a polygonal funnel shape, then shape versatility and heat dissipation are improved, but manufacturing precision requirements increase
Solution Approach 1:
Folding lines are pre-marked or pre-formed on the substrate before the folding process, providing clear guides that simplify the folding operation and reduce the precision requirements during the actual folding step
Solution Approach 2:
The folding creates smooth angular transitions and consistent geometric patterns in the polygonal funnel shape, which can be easily replicated using standard manufacturing tolerances and folding tools
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polygonal funnel shape enables versatile light source support and reflection, enhances heat dissipation, and integrates heat sink and reflector functions, reducing material waste and manufacturing complexity.
Implementation Method 1
The circuit board comprises a substrate, wherein the substrate comprises at least one fold forming a projecting portion and extending from a periphery of the substrate up to an inner portion of the substrate, whereby the substrate has a polygonal funnel shape
Implementation Method 2
the substrate has a polygonal funnel shape
Data Source
AI summary
A circuit board (10) for carrying at least one light source (16) of a lighting device and a method of manufacturing such a circuit board are provided. The circuit board comprises a substrate (1), wherein the substrate comprises at least one fold (9) forming a projecting portion and extending from a periphery (3) of the substrate up to an inner portion (2) of the substrate, whereby the substrate has a polygonal funnel shape. The present aspects use the concept of folding the substrate in order to obtain a polygonal funnel shape of the circuit board, whereby shaping of the substrate without requiring removal of material of the substrate is allowed.