Folded Circuit Board Layout for Bendability and Signal Isolation
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Solution Overview
Problem
Existing circuit boards with multilayer substrates and wiring patterns are not easily bendable or connectable to other circuit boards, limiting their flexibility and positional alignment.
Innovation Solution
A second circuit board with a bent portion and insulating properties, featuring a first opening that extends from the bent portion to either the first or second portion, allowing for easy bending and alignment with a first circuit board, while maintaining structural integrity and reducing electromagnetic field coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple wiring patterns are disposed on the multilayer substrate, then electrical connectivity is improved, but bendability deteriorates
Solution Approach 1:
The multilayer substrate is divided into a first substrate and a second substrate that are separated by a gap, with each substrate having independent wiring patterns. This segmentation allows each substrate to be bent independently, solving the contradiction between maintaining electrical connectivity and achieving bendability.
Solution Approach 2:
The invention transitions from a planar single-substrate structure to a three-dimensional stacked structure with gaps between substrates. This dimensional change enables the circuit board to be folded along the stacked direction while maintaining electrical connections through via holes that penetrate through the substrates.
2Reliability
If the multilayer substrate is bent to connect to the circuit board, then connectivity between boards is improved, but structural integrity deteriorates
Solution Approach 1:
By separating the multilayer substrate into multiple independent substrates with gaps between them, the invention allows the circuit board connection portion to be bent without causing the entire substrate to deform. The segmentation isolates the bending stress to specific regions, preserving overall structural integrity.
Solution Approach 2:
The invention applies different structural characteristics to different regions: the connection portion between substrates has gaps that allow bending, while the wiring regions maintain full structural integrity. This local differentiation enables board connectivity without compromising overall strength.
3Manufacturing precision
If the circuit board is made rigid to maintain wiring pattern stability, then manufacturing precision is improved, but ease of alignment deteriorates
Solution Approach 1:
The circuit board is segmented into multiple substrates that can be independently positioned and aligned. This allows the wiring patterns on each substrate to maintain manufacturing precision while the gaps between substrates provide flexibility for alignment adjustments during assembly.
Data Source
AI summary
An electronic device includes first and second circuit boards. The second circuit board includes a first portion facing a first main surface of the first circuit board, a second portion facing a second main surface opposite to the first main surface, and a bent portion connecting the first portion and the second portion to each other. The second circuit board includes an element, signal conductors, and a first opening. The first opening is between the signal conductors when viewed in a thickness direction of the element. The first opening extends from the first portion to the second portion through the bent portion. The first portion and the second portion each include a portion not including the first opening between the signal conductors.