Folded Cochlear Electrode Array for Higher Contact Density
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Solution Overview
Problem
Conventional electrode arrays for cochlear implants face challenges in manufacturing complexity and limited electrode density due to manual resistance-welding of platinum electrodes and wires, leading to increased costs and decreased yield, as well as limitations in increasing the number of electrodes per unit length.
Innovation Solution
The electrode array is designed with a structured configuration involving contact electrodes, wires, and connection wires, which are integrally formed and folded to increase electrode density, using laser patterning and insulation layers for ease of manufacture and flexibility, allowing for a higher number of electrodes per unit length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual resistance-welding is used to connect platinum electrodes and wires, then reliable electrical connection is achieved, but manufacturing complexity and time increase while yield decreases
Solution Approach 1:
The patent merges the electrode and wire into a single integrally formed structure using laser patterning on a flexible substrate. This eliminates the separate welding step while maintaining reliable electrical connection, thereby improving manufacturing yield and reducing complexity.
Solution Approach 2:
The patent replaces the mechanical welding process with a laser-based patterning process. The electrode and wire are formed as continuous conductive traces on a flexible substrate through laser patterning, substituting the manual mechanical welding operation with an automated optical manufacturing process.
2Reliability
If manual resistance-welding is used to connect platinum electrodes and wires, then reliable electrical connection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent merges the electrode and wire into a single integrally formed structure using laser patterning on a flexible substrate. This eliminates the separate welding step while maintaining reliable electrical connection, thereby improving manufacturing yield and reducing complexity.
Solution Approach 2:
The patent replaces the mechanical welding process with a laser-based patterning process. The electrode and wire are formed as continuous conductive traces on a flexible substrate through laser patterning, substituting the manual mechanical welding operation with an automated optical manufacturing process.
3Ease of manufacture
If conventional electrode structure is used, then ease of manufacturing is maintained, but electrode density per unit length is limited
Solution Approach 1:
The patent transitions from a conventional linear electrode arrangement to a folded three-dimensional structure. By folding the flexible substrate, the electrode array achieves higher electrode density per unit length while maintaining the simplicity of planar laser patterning manufacturing.
Solution Approach 2:
The patent uses a flexible substrate that can be folded into a compact three-dimensional structure. This flexible film approach allows the electrode array to achieve high electrode density while maintaining ease of manufacturing through planar patterning processes followed by folding.
4Quantity of substance
If electrode array is folded to increase density, then electrode density per unit length increases, but manufacturing complexity increases
Solution Approach 1:
The patent uses a flexible substrate that can be folded into a compact three-dimensional structure. This flexible film approach allows the electrode array to achieve high electrode density while maintaining ease of manufacturing through planar patterning processes followed by folding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies manufacturing, increases electrode density, and enhances the flexibility and stability of the electrode array, improving the precision and performance of the cochlear implant device.
Implementation Method 1
a method of manufacturing an electrode array, the method comprising: patterning a conductive material disposed on a substrate to form an electrode structure
Data Source
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AI summary
The embodiment discloses an electrode array including a housing; a plurality of first contact electrodes exposed to an outside of the housing; a plurality of second contact electrodes exposed to the outside of the housing; a first wire group disposed inside the housing and electrically connected to the first contact electrodes; and a second wire group disposed inside the housing and electrically connected to the second contact electrodes, the plurality of first contact electrodes and the first wire group being disposed on different planes within the housing.