Folded Conductor Structure for Magnetic Field Current Sensor
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Solution Overview
Problem
Current current sensors face challenges in accurately measuring electric currents due to the reduction of magnetic field flux density with increasing distance from the current-carrying conductor, leading to reduced sensing accuracy and increased chip size, as well as issues with stray magnetic fields affecting measurement accuracy.
Innovation Solution
A current sensor system is designed with a magnetic field sensor comprising multiple sensor elements aligned in different directions, and a conductor structure geometry that shapes the magnetic field distribution to optimize sensing accuracy, suppress stray fields, and enable differential sensing, allowing for redundant measurements and reduced chip size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the sensor element is placed in close proximity to the current-carrying conductor to improve sensing accuracy, then the magnetic field flux density increases, but the chip size increases and stray magnetic fields affect measurement accuracy
Solution Approach 1:
The patent transitions from a planar conductor configuration to a three-dimensional folded conductor structure that extends vertically above the sensor chip. This dimensional change allows the conductor to carry higher currents while maintaining optimized magnetic field coupling with the sensor elements, resolving the contradiction between sensing accuracy and chip size by utilizing vertical space rather than lateral expansion
Solution Approach 2:
The patent modifies the conductor geometry parameters by folding it into multiple segments (first, second, and third portions) at specific angles relative to the sensor chip. This parameter optimization creates enhanced magnetic field distribution patterns that improve sensing accuracy without requiring increased chip area, as the folded structure concentrates magnetic flux more effectively
2Measurement precision
If the conductor structure is optimized to shape magnetic field distribution for improved sensing accuracy, then measurement precision increases, but device complexity increases
Solution Approach 1:
The patent combines multiple conductor segments (first, second, and third portions) into a single integrated folded conductor structure. This merging approach achieves complex magnetic field shaping functionality through a unified structure rather than multiple separate components, reducing device complexity while maintaining sensing accuracy through optimized field distribution
Solution Approach 2:
The folded conductor structure serves multiple functions simultaneously: it carries the current to be measured, shapes the magnetic field distribution for optimized sensing, and provides mechanical support. This multi-functionality reduces overall device complexity by eliminating the need for separate field-shaping components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances sensing accuracy by optimizing magnetic field flux density at sensor locations, reduces chip size, and increases current carrying capabilities while preventing overheating and manufacturing cost increases, providing robustness against stray magnetic fields and ensuring reliable redundant current sensing.
Implementation Method 1
the first conductor structure produces a first magnetic field based on the current flowing therethrough, wherein the second conductor structure produces a second magnetic field based on the current flowing therethrough, wherein the third conductor structure produces a third magnetic field based on the current flowing therethrough
Implementation Method 2
a magnetic field sensor can generate a measurable quantity, such as a voltage, that is proportional to the magnetic field sensed by the magnetic field sensor
Data Source
AI summary
A current sensor system includes a magnetic field sensor including a chip plane, a first set of sensor elements sensitive to a first magnetic field component that is aligned in a first direction that is parallel to the chip plane, and a second set of sensor elements sensitive to a second magnetic field component that is aligned in a second direction that is perpendicular to the chip plane; and three conductor structures arranged in parallel to each other and configured to carry a current parallel or antiparallel to a third direction that is perpendicular to the first direction and to the second direction. The three conductor structures generate three magnetic fields based on the current flowing therethrough, where the three magnetic fields produce a first magnetic field distribution of the first magnetic field component and a second magnetic field distribution of the second magnetic field component.