Folded Contact Tail Solder Unit Securement
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Solution Overview
Problem
Traditional solder units on contact tails often suffer from contamination and poor securement due to solder flux, leading to unreliable attachment to conductive pads.
Innovation Solution
The design includes a connecting part with a plate body and tails featuring mounting pads with through holes and folded sections to securely hold solder units, allowing the solder to melt and solidify for efficient attachment to conductive pads, eliminating the need for excess solder flux.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder flux is used to attach solder unit to contact tail, then solder unit can be attached, but contamination occurs on contacting section and securement is poor
Solution Approach 1:
The patent removes solder flux from the contacting section of the contact tail, extracting the harmful element while retaining the solder attachment function through a cleaned contacting section that directly bonds with the solder unit without flux contamination
Solution Approach 2:
The contact tail is divided into distinct functional sections: a mounting section with solder resist for solder unit attachment, and a contacting section kept clean and free of solder flux for reliable electrical contact, preventing contamination while maintaining both functions
2Reliability
If solder flux is applied on contact tail, then solder unit can be attached, but securement between solder unit and contact tail is poor
Solution Approach 1:
Solder resist is applied selectively to specific areas of the contact tail mounting section to create localized bonding zones that provide strong mechanical and electrical connection to the solder unit, while the contacting section remains flux-free for optimal electrical contact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a reliable and secure attachment of solder units to contact tails and conductive pads, enhancing the mechanical and electrical connection while minimizing contamination risks.
Implementation Method 1
the solder not only unit may be reliably secured to the corresponding contact tail before mounting to the corresponding conductive pad, but also can be melted to flow through the through hole and solidified to be soldered upon the conductive pad
Data Source
AI summary
An electronic component includes a first module, a second module and a third module between the first module and the second module. Each of the first module and the second module includes a plurality of conductive pads thereon. A connecting part includes a plate body and a plurality of first tails and a plurality of second tails respectively extending on two opposite sides of the plate body wherein the first tails are soldered upon the first conductive pads and the second tails are soldered upon the second conductive pads, respectively. Each of the first tails and the second tails includes a mounting pad with a through hole therein, and a folded section on the end edge with a solder unit received with a space formed in the folded section and communicatively above the corresponding through hole.