Folded Corrugated Substrate Integrated Waveguide DC Biasing
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Solution Overview
Problem
Substrate integrated waveguides face challenges in integrating active elements due to their short-circuit structure, which prevents direct current (DC) biasing, and corrugated substrate integrated waveguides suffer from increased cross-sectional area and leakage radiation, leading to signal distortion and high radiation loss.
Innovation Solution
A folded corrugated substrate integrated waveguide design replaces conductive vias with vertical open stubs connected through via holes, allowing DC power supply and reducing E-plane size, thereby minimizing leakage radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conductive vias are replaced with open stubs to enable DC biasing, then DC power supply capability is improved, but cross-sectional area increases making circuit coupling difficult
Solution Approach 1:
The patent transitions from E-plane open stubs to H-plane folded corrugated structure. By changing the orientation dimension of the corrugations from vertical (E-plane) to horizontal (H-plane), the waveguide enables DC biasing through the folded structure while maintaining a compact cross-sectional area that facilitates circuit coupling.
2Adaptability or versatility
If open stubs are arranged in E-plane direction to enable DC biasing, then DC power supply is improved, but leakage radiation increases causing signal distortion
Solution Approach 1:
The patent inverts the conventional approach by using H-plane folded corrugations instead of E-plane open stubs. This inversion of the corrugation plane orientation eliminates the leakage radiation problem associated with E-plane stubs while preserving DC biasing capability through the folded structure configuration.
Solution Approach 2:
The folded corrugated structure converts the potential harmful leakage radiation into beneficial confining effects. The folded configuration creates multiple reflections that trap the electromagnetic energy within the waveguide, transforming what would be leakage into a mechanism that enhances signal confinement and reduces radiation loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables DC biasing while reducing unnecessary radiation and power loss, improving signal integrity and matching properties across the frequency band.
Implementation Method 1
substrate integrated waveguides are pseudospherical waveguides in which two parallel metallic via holes or via walls are periodically arranged on a general printed circuit board (PCB)
Implementation Method 2
the respective stub conductors of the two rows are electrically connected to the top stubs of the first conductor plate, whose locations correspond thereto, through via holes which vertically penetrate the first dielectric substrate, the second conductor plate, and the second dielectric substrate
Implementation Method 3
a first dielectric substrate whose top surface is attached to a bottom surface of the first conductor substrate, a second conductor plate whose top surface is attached to a bottom surface of the first dielectric substrate, a second dielectric substrate whose top surface is attached to a bottom surface of the second conductor plate
Data Source
AI summary
A folded corrugated substrate integrated waveguide is disclosed. The folded corrugated substrate integrated waveguide, according to one embodiment of the present invention, comprises: a first conductor plate having upper surface stubs respectively formed on both sides thereof in the lengthwise direction; a first dielectric substrate of which the upper surface is attached to the lower surface of the first conductor plate; a second conductor plate of which the upper surface is attached to the lower surface of the first dielectric substrate; a second dielectric substrate of which the upper surface is attached to the lower surface of the second conductor plate; and two stub conductor arrays spaced at a certain distance so as to be arranged in parallel to each other and attached to the lower surface of the second dielectric substrate, wherein each of the stub conductors in the two stub conductor arrays is electrically connected to a position corresponding to the upper surface stub of the first conductor plate through a via-hole which vertically penetrates the first dielectric substrate, the second conductor plate, and the second dielectric substrate.


